公开(公告)号：US11293112B2

公开(公告)日：2022-04-05

申请号：US17074910

申请日：2020-10-20

Applicant: U-PRO MACHINES CO., LTD.

Inventor： Hsin-Chi Iou

IPC: C25D17/08 ,  C25D17/12 ,  C25D17/00

Abstract: A electrode frame having the first frame group covered the first conductive frame strip, and the first conductive frame strip has first frame strip conductive component and multiple first substrate conductive components; the second frame group covered the second conductive frame strip, and the second conductive frame strip has second frame strip conductive component and multiple second substrate conductive components; when the first frame group and the second frame group are combined, above mentioned components are all electrically connected; the conductive hanger conducts electricity to the inner frame strips, then conducts electricity to the first and second substrate conductive components, and the substrate conductive components separately electrically connect to lateral side of the substrate for making the electric current conduct uniformly on the both lateral side and the surrounding of the substrate.

公开(公告)号：US11414775B1

公开(公告)日：2022-08-16

申请号：US17319330

申请日：2021-05-13

Applicant: U-PRO MACHINES CO., LTD.

Inventor： Hsin-Chi Iou ,  Huan-Chun Lin ,  Hsu-Cheng Peng

IPC: C25D17/08

Abstract: A power supply system for a vertical continuous electroplating frame, comprising: a power supply rail arranged on the vertical continuous electroplating device; and an electrode case, arranged a case body on the top surface of the electroplating frame, inside the case body having an electrode plate corresponding to the power supply rail, at the bottom of the electrode plate having an elastic unit, the top surface of the case body having a positioning groove corresponding to the electrode plate, when the electrode plate is electrical contacted with the power supply rail, the electroplating current is provided to the object to be plated through the electroplating frame.

公开(公告)号：US10772212B1

公开(公告)日：2020-09-08

申请号：US16713636

申请日：2019-12-13

Applicant: U-PRO MACHINES CO., LTD.

Inventor： Hsin-Chi Iou ,  Chieh-Yuan Cheng

IPC: H05K3/00 ,  H05K3/08 ,  H05K3/24 ,  C25D5/00 ,  C25D5/02 ,  C25D5/08 ,  C25D17/00 ,  C25D17/02 ,  C25D17/12 ,  H05K3/18 ,  C25D17/08

Abstract: The present invention relates to an electrochemical or chemical treatment device for high aspect ratio circuit board with through hole comprises: an electroplating tank; a solution storage tank; a positioning frame, the positioning frame fixes the circuit board inside the electroplating tank for the electroplating tank to be divided into a solution accumulated area and a suction area by the positioning frame and the circuit board; a priming piping sucking solution from the solution storage tank to the solution accumulated area; a suction cap corresponding to the suction area; and a suction piping connected to the suction cap, using the negative pressure produced by suction to make the solution flow through the through hole of the circuit board, and further having a better result of electroplating the bore of through hole of the high aspect ratio circuit board.