公开(公告)号：US20210222289A1

公开(公告)日：2021-07-22

申请号：US15734889

申请日：2019-07-04

Applicant: ULVAC, INC.

Inventor： Yutaka KOKAZE ,  Teruaki IIWAHASHI ,  Shunsuke SASAKI

IPC: C23C14/35 ,  C23C14/50 ,  C23C14/34 ,  H01J37/34

Abstract: A sputtering apparatus includes a plate-shaped regulator that is provided between a target and a substrate, has an opening corresponding to a magnetic circuit, and covers a portion not corresponding to the magnetic circuit. The regulator covers at least a surface area that is greater than or equal to a half of a surface area of the substrate. The opening has a substantially fan-shaped outline. The opening is arranged so as to substantially coincide with the magnetic circuit when viewed in a direction of a rotation axis line of the target, and the rotation axis line of the target and a rotation axis line of the substrate are arranged substantially parallel to each other.