公开(公告)号：US11670520B2

公开(公告)日：2023-06-06

申请号：US17523093

申请日：2021-11-10

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Jia Shiang Chen ,  Chung-Yu Lan ,  Yu-Shen Chen

IPC: H01L21/00 ,  H01L21/48 ,  H01L23/538 ,  H01L23/498 ,  H05K1/18 ,  H01L25/065

CPC classification number: H01L21/486 ,  H01L23/49805 ,  H01L23/5384 ,  H01L25/0657 ,  H05K1/182 ,  H05K1/186 ,  H01L2225/06517 ,  H01L2225/06572

Abstract: A packaging method includes steps of: forming first and second wiring layers electrically connected to each other on two opposite surfaces of a substrate; then configuring mother substrate interconnecting bumps on the first wiring layer and along perimeter of a daughter substrate unit, and then cutting along the perimeter of the daughter substrate unit to expose lateral faces of the mother substrate interconnecting bumps and configuring solder materials thereon; then configuring first and second chips on the first and the second wiring layers to form electrical interconnection between the two chips. A package structure enables interconnecting two chips through one single daughter substrate unit with its wiring layers directly connecting with lateral face contacts of the mother carrier substrate through the mother substrate interconnecting bumps. Hence, area of the daughter substrate unit is reduced; lengths of the interconnection paths are shortened, and qualities of communication and space utilization are enhanced.