公开(公告)号：US20210375737A1

公开(公告)日：2021-12-02

申请号：US16944179

申请日：2020-07-31

Applicant: UNIMICRON TECHNOLOGY CORPORATION

Inventor： CHIEN-CHEN LIN

IPC: H01L23/498 ,  H01L21/48

Abstract: An embedded component substrate structure and a method for manufacturing the same, with a carrier structure being formed with a groove on a top, and a chip structure with a plurality of conductors disposed in the groove. Dielectric layers are disposed on a top and a bottom of the carrier structure, and two opposite ends of multiple circuits in the carrier structure are exposed to the dielectric layers. Circuit build-up structures are disposed on the dielectric layers, and electrically connect to the circuits of the carrier structure.