公开(公告)号：US20140264335A1

公开(公告)日：2014-09-18

申请号：US13845800

申请日：2013-03-18

Applicant: UNIMICRON TECHNOLOGY CORPORATION

Inventor： Dyi-Chung Hu ,  Tsung-Si Wang ,  Jui-Yang Ma

IPC: H01L21/66

CPC classification number: H01L22/14 ,  H01L22/32 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package substrate is provided, including a board body having a wiring region and a testing region defined thereon, conductive pads embedded in the wiring region, and a plurality of testing pads disposed in the testing region and electrically connected to the conductive pads, wherein the top surface area of each of the testing pads is greater than the top surface area of each of the conductive pads in order to facilitate a precise alignment of a probe with a corresponding one of the testing pads and prevent the probe from being blocked by the board body when in electrically testing an embedded circuit.

Abstract translation: 提供一种封装基板，包括具有布线区域和限定在其上的测试区域的板体，嵌入布线区域中的导电焊盘以及设置在测试区域中并电连接到导电焊盘的多个测试焊盘，其中， 每个测试焊盘的顶表面积大于每个导电焊盘的顶表面积，以便于探针与对应的一个测试焊盘的精确对准，并防止探针被板阻挡 身体在电测试嵌入式电路时。