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公开(公告)号:US20190002711A1
公开(公告)日:2019-01-03
申请号:US15840667
申请日:2017-12-13
Inventor: Jae Sung SON , Fredrick KIM
IPC: C09D11/02 , C09D11/03 , B33Y10/00 , B33Y70/00 , B33Y80/00 , B28B1/00 , H01L35/16 , H01L35/08 , H01L35/32 , H01L35/34
Abstract: A thermoelectric (TE) ink for TE materials, a TE module using the TE ink, and a method of manufacturing the TE module are provided. The TE ink may include an inorganic binder including chalcogenidometallate (ChaM), and TE particles including Bi2-xSbxTe3-ySey (0≤x≤2, 0≤y≤1).