公开(公告)号：US11551955B2

公开(公告)日：2023-01-10

申请号：US16831739

申请日：2020-03-26

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ming-Che Lai ,  Hua-Wei Peng ,  Chia-He Cheng ,  Ming-Tso Chen ,  Chao-Chi Lu ,  Hsin-Hsu Lin ,  Kuo-Tsai Lo ,  Kao-Hua Wu ,  Huan-Hsin Yeh

IPC: H01L21/67 ,  G05B19/418 ,  G06T7/00

Abstract: A substrate processing apparatus includes a process station for processing a substrate; a cassette station integrated with the process station; a substrate carriage equipped for transferring the substrate between said process station and the cassette station through a passage located at an interface between the process station and said cassette station; and a substrate scanner equipped at said interface between the process station and the cassette station for capturing surface image data during transportation of the substrate that passes through the passage.

公开(公告)号：US20210280444A1

公开(公告)日：2021-09-09

申请号：US16831739

申请日：2020-03-26

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ming-Che Lai ,  Hua-Wei Peng ,  Chia-He Cheng ,  Ming-Tso Chen ,  Chao-Chi Lu ,  Hsin-Hsu Lin ,  Kuo-Tsai Lo ,  Kao-Hua Wu ,  Huan-Hsin Yeh

IPC: H01L21/67 ,  G05B19/418 ,  G06T7/00

Abstract: A substrate processing apparatus includes a process station for processing a substrate; a cassette station integrated with the process station; a substrate carriage equipped for transferring the substrate between said process station and the cassette station through a passage located at an interface between the process station and said cassette station; and a substrate scanner equipped at said interface between the process station and the cassette station for capturing surface image data during transportation of the substrate that passes through the passage.