公开(公告)号：US20200223687A1

公开(公告)日：2020-07-16

申请号：US16284735

申请日：2019-02-25

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yuan-Sheng LIN ,  Jung-Hao CHANG ,  Chang-Sheng HSU ,  Weng-Yi CHEN

IPC: B81B7/00 ,  B81C1/00

Abstract: A MEMS structure includes a substrate, a dielectric layer, a membrane, a backplate, and a blocking layer. The substrate has a through-hole. The dielectric layer is disposed on the substrate and has a cavity in communication with the through-hole. The membrane has at least one vent hole, is embedded in the dielectric layer and together with the dielectric layer defines a first chamber that communicates with the through-hole. The backplate is disposed on the dielectric layer. One end of the blocking layer is embedded in the dielectric layer, and the other end of the blocking layer extends into the cavity; the blocking layer is spatially isolated from the membrane and at least partially overlaps with the at least one vent hole.