公开(公告)号：US20200223687A1

公开(公告)日：2020-07-16

申请号：US16284735

申请日：2019-02-25

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yuan-Sheng LIN ,  Jung-Hao CHANG ,  Chang-Sheng HSU ,  Weng-Yi CHEN

IPC: B81B7/00 ,  B81C1/00

Abstract: A MEMS structure includes a substrate, a dielectric layer, a membrane, a backplate, and a blocking layer. The substrate has a through-hole. The dielectric layer is disposed on the substrate and has a cavity in communication with the through-hole. The membrane has at least one vent hole, is embedded in the dielectric layer and together with the dielectric layer defines a first chamber that communicates with the through-hole. The backplate is disposed on the dielectric layer. One end of the blocking layer is embedded in the dielectric layer, and the other end of the blocking layer extends into the cavity; the blocking layer is spatially isolated from the membrane and at least partially overlaps with the at least one vent hole.

公开(公告)号：US20220119248A1

公开(公告)日：2022-04-21

申请号：US17075737

申请日：2020-10-21

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Jung-Hao CHANG ,  Weng-Yi CHEN

IPC: B81C1/00 ,  B81B7/00 ,  H04R19/04 ,  H04R7/06 ,  H04R31/00

Abstract: A micro electromechanical system (MEMS) includes a substrate, a semiconductor device and a protection wall. The substrate has a surface. The semiconductor device is disposed on the surface. The protection wall has a poly-silicon layer surrounding the semiconductor device and connecting to the surface.

公开(公告)号：US20240158225A1

公开(公告)日：2024-05-16

申请号：US18075882

申请日：2022-12-06

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Jung-Hao CHANG ,  Weng-Yi CHEN

IPC: B81C1/00 ,  B81B7/02

CPC classification number: B81C1/00476 ,  B81B7/02 ,  B81B2201/0257 ,  B81B2203/0315 ,  B81B2203/033 ,  B81B2203/0353 ,  B81B2207/01 ,  B81C2201/0108 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2201/014 ,  B81C2201/0176

Abstract: A micro electro mechanical system (MEMS) device and a method for manufacturing the same are provided. The MEMS device includes a substrate, a polymer film on the substrate and having a lower surface facing toward the substrate, a cavity passing through the substrate, and coil structures on the substrate and in the polymer film. The polymer film includes a corrugation pattern on the lower surface of the polymer film. A portion of the polymer film is exposed in the cavity.