公开(公告)号：US20230363278A1

公开(公告)日：2023-11-09

申请号：US18224711

申请日：2023-07-21

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Zhi-Biao ZHOU

IPC: H10N30/05 ,  H10N30/072 ,  H10N30/80

CPC classification number: H10N30/05 ,  H10N30/072 ,  H10N30/80

Abstract: A method for manufacturing a semiconductor module is provided. The method includes: providing a substrate, wherein the substrate comprises a front side and at least one semiconductor element formed on the front side; forming a shielding structure on the at least one semiconductor element; forming a piezoelectric layer on the shielding structure.

公开(公告)号：US20250138304A1

公开(公告)日：2025-05-01

申请号：US18386619

申请日：2023-11-03

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Zhi-Biao ZHOU

IPC: G02B26/10 ,  G02B26/08

Abstract: A projection system is provided. The projection system includes at least one micro LED line and a scan optical system. The micro LED line is configured for emitting lights with a changing frequency of X times per second. The scan optical system is disposed at a downstream side of the at least one micro LED line. The scan optical system is configured to scan the lights emitted from the micro LED line with a scan rate of M seconds per scan and to project images formed of the lights to corresponding positions on a target projection plane. The projection system has a horizontal resolution of N lines. A total number n of the at least one micro LED line is smaller than N. Also, X=M*(N/n).