Semiconductor device having resistance elements and fabrication method thereof

    公开(公告)号:US10720489B2

    公开(公告)日:2020-07-21

    申请号:US16460400

    申请日:2019-07-02

    IPC分类号: H01L27/06 H01L49/02 H01L27/08

    摘要: A semiconductor device includes as a resistance element a first polycrystalline silicon and a second polycrystalline silicon containing impurities, such as boron, of the same kind and having different widths. The first polycrystalline silicon contains the impurities at a concentration CX. The second polycrystalline silicon has a width larger than a width of the first polycrystalline silicon and contains the impurities of the same kind at a concentration CY lower than the concentration CX. A sign of a temperature coefficient of resistance (TCR) of the first polycrystalline silicon changes at the concentration CX. A sign of a TCR of the second polycrystalline silicon changes at the concentration CY.