公开(公告)号：US12083625B2

公开(公告)日：2024-09-10

申请号：US16839753

申请日：2020-04-03

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： Xiaomei Fang ,  Christopher J. Hertel ,  John D. Riehl ,  John W. Connell ,  Frank L. Palmieri ,  John W. Hopkins

IPC: B23K26/359 ,  B23K26/0622 ,  B23K103/04

CPC classification number: B23K26/359 ,  B23K26/0622 ,  B23K2103/05

Abstract: Methods and systems for the laser surface treatment on stainless steel alloys and nickel alloys may include a computer may be programmed to set a laser path corresponding to a predetermined geometric pattern. A laser may be coupled to the computer and apply a pulsed laser beam to a contact surface of the substrate along the predefined geometric pattern. The pulsed laser beam may have a laser power between 0.1 W and 100 W, single pulse fluence 1 mJ/mm2 and 1025 mJ/mm2 and a laser speed between 25.4 cm/s and 127 cm/s. The laser may generate an open pore oxide layer on the contact surface of the substrate with a thickness of 0.1-1 μm, an open pore distance of 0.05-1 μm. The open pore oxide layer may have a topography corresponding to the predefined geometric pattern. The topography may contain open pore structures and promote adhesive bond performance.

公开(公告)号：US20200316721A1

公开(公告)日：2020-10-08

申请号：US16839753

申请日：2020-04-03

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： XIAOMEI FANG ,  Christopher J. Hertel ,  John D. Riehl ,  John W. Connell ,  Frank L. Palmieri ,  John W. Hopkins

IPC: B23K26/359 ,  B23K26/0622

Abstract: Methods and systems for the laser surface treatment on stainless steel alloys and nickel alloys may include a computer may be programmed to set a laser path corresponding to a predetermined geometric pattern. A laser may be coupled to the computer and apply a pulsed laser beam to a contact surface of the substrate along the predefined geometric pattern. The pulsed laser beam may have a laser power between 0.1 W and 100 W, single pulse fluence 1 mJ/mm2 and 1025 mJ/mm2 and a laser speed between 25.4 cm/s and 127 cm/s. The laser may generate an open pore oxide layer on the contact surface of the substrate with a thickness of 0.1-1 μm, an open pore distance of 0.05-1 μm. The open pore oxide layer may have a topography corresponding to the predefined geometric pattern. The topography may contain open pore structures and promote adhesive bond performance.