公开(公告)号：US20220106435A1

公开(公告)日：2022-04-07

申请号：US17426228

申请日：2020-01-21

Applicant: UNITIKA LTD.

Inventor： Ayumi YANAKA ,  Yumeto FUKUBAYASHI ,  Takatoshi MURAKAMI

IPC: C08G59/40 ,  C08G59/42 ,  C08G59/22 ,  C08G59/32 ,  C08J5/24 ,  C08J5/04 ,  C08L63/00 ,  C08G59/02

Abstract: The present invention provides an epoxy resin solution, from which an epoxy resin-cured product adequately excellent in heat-resisting properties and dielectric properties can be obtained with adequately good working properties ensured. The present invention relates to an epoxy resin solution containing at least a curing agent and an epoxy resin mixed in an organic solvent, wherein the curing agent comprises an imide group-containing curing agent having 1-4 imide groups and 2-4 glycidyl group-reactive functional groups in a molecule.

公开(公告)号：US20210139390A1

公开(公告)日：2021-05-13

申请号：US17257199

申请日：2019-06-28

Applicant: UNITIKA LTD.

Inventor： Yumeto FUKUBAYASHI ,  Makoto NAKAI ,  Ayumi YANAKA

IPC: C07B61/00 ,  C07C233/77 ,  C07C233/81 ,  C08G63/78

Abstract: The present invention provides a production method of an organic compound, in which a reaction is performed between functional groups without using any solvents. The present invention relates to a production method of an organic compound, in which a reaction is performed between functional groups by using a mechanochemical effect.