公开(公告)号：US20210383563A1

公开(公告)日：2021-12-09

申请号：US17401760

申请日：2021-08-13

Applicant: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA

Inventor： Yuhua CHENG ,  Chun YIN ,  Xiao YANG ,  Kai CHEN ,  Xuegang HUANG ,  Gen QIU ,  Yinze WANG

IPC: G06T7/62 ,  G06T7/00 ,  G06T7/30 ,  G06T3/00

Abstract: The present invention provides a method for quantitatively identifying the defects of large-size composite material based on infrared image sequence, firstly obtaining the overlap area of an infrared splicing image, and dividing the infrared splicing image into three parts according to overlap area: overlap area, reference image area and registration image area, then extracting the defect areas from the infrared splicing image to obtain P defect areas, then obtaining the conversion coordinates of pixels of defect areas according to the three parts of the infrared splicing image, and further obtaining the transient thermal response curves of centroid coordinate and edge point coordinates, finding out the thermal diffusion points from the edge points of defect areas according to a created weight sequence and dynamic distance threshold εttr×dp_max, finally, based on the thermal diffusion points, the accurate identification of quantitative size of defects are completed.