公开(公告)号：US20220214498A1

公开(公告)日：2022-07-07

申请号：US17605500

申请日：2020-04-24

Applicant: UNIVERSITY OF SOUTHAMPTON

Inventor： David THOMSON ,  Graham REED ,  Wei Wei ZHANG ,  Martin EBERT

IPC: G02B6/122 ,  G02B6/13 ,  G02B6/132 ,  G02B6/136

Abstract: The invention provides a photonic chip comprising: a silicon substrate, an low refractive index layer above the silicon substrate, and a tapered waveguide above the low refractive index layer, the tapered waveguide having a first height at a first end of the tapered waveguide and a second height at a second end of the tapered waveguide, the second height being greater than the first height, and the tapered waveguide having a bottom surface that is closer to the substrate at the second end than at the first end. The invention further provides a method of manufacturing a photonic chip, the method comprising: providing a wafer comprising a silicon substrate, and an low refractive index layer above the silicon substrate, etching the low refractive index layer to form a tapered trench having a first height at a first end of the tapered trench and a second height at a second end of the tapered trench, the first second height being greater than the second first height, and the tapered trench having a bottom surface that is closer to the substrate at the first second end than at the second first end, and forming a tapered waveguide in the tapered trench.