公开(公告)号：US20250151447A1

公开(公告)日：2025-05-08

申请号：US18927456

申请日：2024-10-25

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  Catherine Chang ,  Il Kwon Shim

IPC: H01L27/146

Abstract: A semiconductor device has a semiconductor die including a photonic circuit. A first adhesive bead is deposited over the semiconductor die around the photonic circuit. A second adhesive bead is deposited over the first adhesive bead. An inner edge of the second adhesive bead is offset toward the photonic circuit relative to an inner edge of the first adhesive bead. A lens is disposed over the second adhesive bead. An encapsulant is deposited over the semiconductor die and lens.

公开(公告)号：US20250151421A1

公开(公告)日：2025-05-08

申请号：US18926920

申请日：2024-10-25

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  Catherine Chang ,  Il Kwon Shim

IPC: H01L27/146 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00

Abstract: A semiconductor device has a photonic semiconductor die and a lens mounted onto the photonic semiconductor die. The photonic semiconductor die and lens are singulated prior to mounting the lens onto the photonic semiconductor die. An adhesive bead is formed on the photonic semiconductor die to seal a cavity between the lens and photonic semiconductor die. The photonic semiconductor die and lens are disposed into a storage media for transporting the photonic semiconductor die to a semiconductor packaging facility. The photonic semiconductor and lens are disposed on a substrate after mounting the lens onto the photonic semiconductor die. An encapsulant is deposited over the substrate, lens, and photonic semiconductor die.