公开(公告)号：US20240186346A1

公开(公告)日：2024-06-06

申请号：US18516997

申请日：2023-11-22

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  Catherine Cheh Yee Chang ,  Il Kwon Shim

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14618 ,  H01L24/45 ,  H01L24/48 ,  H01L27/14683 ,  H01L24/32 ,  H01L27/14636 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48227

Abstract: A semiconductor package for a sensor is disclosed. The package includes an opaque layer on the encapsulation to prevent the wire bonds encased by the encapsulation from being visible to the naked eye. This reduces or prevents reflectance which improves the performance of the sensor. In some cases, the opaque layer extends beyond the encapsulation to cover a peripheral portion of the cover to form a cover opaque region. The cover opaque region reduces or prevents flaring and scattering of light, further enhancing the performance of the sensor.