公开(公告)号：US20240339484A1

公开(公告)日：2024-10-10

申请号：US18747638

申请日：2024-06-19

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： IL Kwon Shim ,  Jeffrey Punzalan

IPC: H01L27/146 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L27/14685 ,  H01L23/315 ,  H01L24/29 ,  H01L27/14625 ,  H01L23/49822 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/29011 ,  H01L2224/32225 ,  H01L2224/48225

Abstract: A semiconductor device has a substrate. A semiconductor die with a photosensitive circuit is disposed over the substrate. A lens comprising a protective layer is disposed over the photosensitive circuit. An encapsulant is deposited over the substrate, semiconductor die, and lens. The protective layer is removed after depositing the encapsulant.

公开(公告)号：US20210193483A1

公开(公告)日：2021-06-24

申请号：US17125995

申请日：2020-12-17

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： IL Kwon Shim ,  Jeffrey Punzalan

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/00

Abstract: A method for forming a semiconductor package is disclosed. The method includes providing a package substrate having a die attach region with a die attached thereto. A protective cover is disposed over a sensor region of the die and attached to the die by a cover adhesive. The protective cover is supported by a standoff structure disposed on the die and below the protective cover. An encapsulant is disposed to cover the package substrate while leaving the top package surface exposed.