公开(公告)号：US20190051585A1

公开(公告)日：2019-02-14

申请号：US16057792

申请日：2018-08-07

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Antonio Bambalan DIMAANO JR. ,  Nataporn CHARUSABHA ,  Saravuth SIRINORAKUL ,  Preecha JOYMAK ,  Roel Adeva ROBLES

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48

Abstract: Embodiments of the present invention are directed to a semiconductor package with improved thermal performance. The semiconductor package includes a package substrate comprising a top substrate surface and a bottom substrate surface. The package substrate comprises a thickness extending from the top substrate surface to the bottom substrate surface. A heat spreader is disposed on the top substrate surface. The heat spreader comprises a thickness extending from a top planar surface to a bottom planar surface of the heat spreader. The top planar surface of the heat spreader is defined with a die region and a non-die region surrounding the die region. A semiconductor die is directly disposed on the top planar surface of the heat spreader in the die region. The thickness of the heat spreader is greater relative to the thickness of the package substrate.