公开(公告)号：US20100001382A1

公开(公告)日：2010-01-07

申请号：US12165932

申请日：2008-07-01

申请人： Ubol Udompanyavit ,  Sreenivasan K. Koduri ,  Gerald William Steele ,  Jason Marc Cole ,  Steven Kummerl

发明人： Ubol Udompanyavit ,  Sreenivasan K. Koduri ,  Gerald William Steele ,  Jason Marc Cole ,  Steven Kummerl

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.

摘要翻译： 一种集成电路封装，包括引线框架，位于引线框架上的集成电路和耦合到引线框架和集成电路的分流电阻器。 分流电阻器具有比引线框架更低的电阻温度系数，并且引线框架具有比分流电阻器更低的电阻率。 分流电阻器具有与引线框架的外部引线的低电阻耦合，或者分流电阻器具有其自己的集成外部引线。

公开(公告)号：US07847391B2

公开(公告)日：2010-12-07

申请号：US12165932

申请日：2008-07-01

申请人： Ubol Udompanyavit ,  Sreenivasan K. Koduri ,  Gerald William Steele ,  Jason Marc Cole ,  Steven Kummerl

发明人： Ubol Udompanyavit ,  Sreenivasan K. Koduri ,  Gerald William Steele ,  Jason Marc Cole ,  Steven Kummerl

IPC分类号： H01L23/52 ,  H01L23/48

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.

摘要翻译： 一种集成电路封装，包括引线框架，位于引线框架上的集成电路和耦合到引线框架和集成电路的分流电阻器。 分流电阻器具有比引线框架更低的电阻温度系数，并且引线框架具有比分流电阻器更低的电阻率。 分流电阻器具有与引线框架的外部引线的低电阻耦合，或者分流电阻器具有其自己的集成外部引线。