METHOD AND DEVICE FOR THE PLACEMENT OF ELECTRONIC COMPONENTS

    公开(公告)号:US20170116720A1

    公开(公告)日:2017-04-27

    申请号:US15297419

    申请日:2016-10-19

    IPC分类号: G06T7/00 G06T7/73

    摘要: A method for placing electronic components onto a circuit board, comprising the following steps: Placing a component to be placed of a first component type into a starting position; creating a component image of the component to be placed in the starting position; creating a circuit board region image of a circuit board of a first circuit board region type; calculating a travel path for moving the component to be placed into a final position on the circuit board based upon an image overlay of the component image and a previously saved reference component image of a reference component of the first component type, and based upon a previously saved reference travel path of the reference component from a reference starting position into a reference final position on a reference circuit board of the first circuit board region type, and based upon an image overlay of the circuit board region image and a previously saved reference circuit board region image of the reference circuit board; moving the component to be placed along the travel path into the final position.