Image analysis for pick and place machines with in situ component placement inspection
    3.
    发明授权
    Image analysis for pick and place machines with in situ component placement inspection 有权
    具有原位部件放置检查的拾放机的图像分析

    公开(公告)号:US07813559B2

    公开(公告)日:2010-10-12

    申请号:US11131926

    申请日:2005-05-18

    IPC分类号: G06K9/68

    摘要: The present invention includes a method of determining a location of a component on a workpiece. A before-placement standard image is acquired of an intended placement location on a standard workpiece. Then, a standard component is placed upon the standard workpiece and the placement is verified. An after-placement standard image is acquired and a standard difference image is created from the before and after standard images. Then, a before-placement test image is acquired of an intended placement location on the workpiece. A component is then placed upon the workpiece, and after-placement test image is acquired. A test difference image is created from the before and after test images. A first offset is calculated between the before standard difference image and the before test image. Then, the test difference is transformed based on the first offset to generate a difference test image (DTR) that is registered to the standard difference image. The standard difference image is correlated to the registered difference test image (DTR) to generate a registration offset indicative of placement efficacy.

    摘要翻译: 本发明包括确定部件在工件上的位置的方法。 在标准工件上获取预定的放置位置的放置前标准图像。 然后,将标准部件放置在标准工件上并验证放置。 获取后置标准图像,并且从标准图像之前和之后创建标准差分图像。 然后,获取在工件上的预期放置位置的放置前测试图像。 然后将部件放置在工件上,并且获取放置后测试图像。 测试差异图像是从前后测试图像创建的。 在之前的标准差图像和之前的测试图像之间计算第一偏移。 然后,基于第一偏移来变换测试差,以生成被登记到标准差分图像的差分测试图像(DTR)。 标准差图像与登记的差异检验图像(DTR)相关,以产生指示放置效力的登记偏移。

    Machine suitable for placing a component on a substrate, as well as a method therefor
    4.
    发明申请
    Machine suitable for placing a component on a substrate, as well as a method therefor 审中-公开
    适于将元件放置在基底上的机器及其方法

    公开(公告)号:US20060059502A1

    公开(公告)日:2006-03-16

    申请号:US10541984

    申请日:2004-01-12

    IPC分类号: G11B7/24

    摘要: Machine (1) comprising a placement element (7) connected to an imaging device (6), and comprising an optical system (4) for detecting the position of a component (16) relative to the placement element (7) by means of the imaging device (6). The optical system (4) comprises at least one marking element (11). The marking element (11) and the component (16) can be displayed simultaneously by means of the optical system (4) in an image (17) to be made by means of the imaging device (6).

    摘要翻译: 机器(1)包括连接到成像装置(6)的放置元件(7),并且包括用于通过所述光学系统检测元件(16)相对于所述放置元件(7)的位置的光学系统(4) 成像装置(6)。 光学系统(4)包括至少一个标记元件(11)。 标记元件(11)和部件(16)可以通过借助于成像装置(6)制成的图像(17)中的光学系统(4)同时显示。

    METHOD AND DEVICE FOR THE PLACEMENT OF ELECTRONIC COMPONENTS

    公开(公告)号:US20170116720A1

    公开(公告)日:2017-04-27

    申请号:US15297419

    申请日:2016-10-19

    IPC分类号: G06T7/00 G06T7/73

    摘要: A method for placing electronic components onto a circuit board, comprising the following steps: Placing a component to be placed of a first component type into a starting position; creating a component image of the component to be placed in the starting position; creating a circuit board region image of a circuit board of a first circuit board region type; calculating a travel path for moving the component to be placed into a final position on the circuit board based upon an image overlay of the component image and a previously saved reference component image of a reference component of the first component type, and based upon a previously saved reference travel path of the reference component from a reference starting position into a reference final position on a reference circuit board of the first circuit board region type, and based upon an image overlay of the circuit board region image and a previously saved reference circuit board region image of the reference circuit board; moving the component to be placed along the travel path into the final position.

    METHOD FOR REGISTERING INSPECTION STANDARD FOR SOLDERING INSPECTION AND BOARD INSPECTION APPARATUS THEREBY
    10.
    发明申请
    METHOD FOR REGISTERING INSPECTION STANDARD FOR SOLDERING INSPECTION AND BOARD INSPECTION APPARATUS THEREBY 审中-公开
    注册检验检验标准的方法及其检测装置

    公开(公告)号:US20130182942A1

    公开(公告)日:2013-07-18

    申请号:US13738320

    申请日:2013-01-10

    申请人: OMRON CORPORATION

    IPC分类号: G06T7/00

    摘要: Performing an inspection based on a shape of a solder fillet and setting a standard of the inspection. In order to set the standard of the inspection by a method for determining whether the solder fillet of a component mounted on a board is proper by obtaining a calculation of a numerical parameter indicating a three-dimensional shape of the solder fillet, a setting screen including an image display region indicating an image of a component of a setting target and an inspection standard list is displayed to receive a user manipulation. A list in which an item name of each of plural inspection items is correlated with an input field of a standard value of a numerical parameter measured by the inspection item is displayed in the inspection standard list.

    摘要翻译: 根据焊盘的形状进行检查,并设定检验标准。 为了通过获取表示焊锡圆角的三维形状的数值参数的计算,通过用于确定安装在板上的部件的焊锡圆角是否合适的方法来设定检查的标准,设置屏幕包括 显示表示设定对象的成分的图像的图像显示区域和检查标准列表,以接收用户操作。 在检查标准列表中显示将多个检查项目中的每一个的项目名称与由检查项目测量的数值参数的标准值的输入字段相关联的列表。