公开(公告)号：US20200176369A1

公开(公告)日：2020-06-04

申请号：US16785630

申请日：2020-02-09

Applicant: Unimicron Technology Corp.

Inventor： Chun-Min WANG ,  Pu-Ju LIN ,  Cheng-Ta KO

IPC: H01L23/498 ,  H01L25/10 ,  H01L23/31 ,  H01L21/48 ,  H01L23/00

Abstract: A package structure includes a redistribution structure, a chip, an inner conductive reinforcing element, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The inner conductive reinforcing element is disposed over the redistribution structure. The inner conductive reinforcing element has a Young's modulus in a range of from 30 to 200 GPa. The protective layer covers the chip and a sidewall of an opening of the inner conductive reinforcing element.