公开(公告)号：US20200235272A1

公开(公告)日：2020-07-23

申请号：US16842716

申请日：2020-04-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei WANG ,  Cheng-Ta KO ,  Yu-Hua CHEN ,  De-Shiang LIU ,  Tzyy-Jang TSENG

IPC: H01L33/62

Abstract: A manufacturing method of a light emitting device package structure is provided. The method includes following operations: (i) providing a circuit redistribution structure; (ii) providing a first substrate; (iii) forming a circuit layer structure over the first substrate, wherein the circuit layer structure includes a first circuit layer; (iv) before or after operation (iii), placing a light emitting device between the first substrate and the circuit layer structure or over the circuit layer structure, wherein the light emitting device is electrically connected with the first circuit layer; and (v) placing the circuit redistribution structure over the light emitting device, wherein the circuit redistribution structure includes a first redistribution layer, a second redistribution layer, and a chip, and the first redistribution layer includes a second circuit layer and a conductive contact that contacts the second circuit layer.

公开(公告)号：US20200006610A1

公开(公告)日：2020-01-02

申请号：US16140563

申请日：2018-09-25

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei WANG ,  Cheng-Ta KO ,  Yu-Hua CHEN ,  De-Shiang LIU ,  Tzyy-Jang TSENG

IPC: H01L33/62

Abstract: A light emitting device package structure includes a substrate, a circuit layer structure, a light emitting device, a first redistribution layer, a conductive connector, a second redistribution layer, and a chip. The circuit layer structure is disposed over the substrate, and the circuit layer structure includes a first circuit layer. The light emitting device is disposed over the circuit layer structure and is electrically connected with the first circuit layer. The first redistribution layer is disposed over the light emitting device and includes a second circuit layer and a conductive contact contacting the second circuit layer. The conductive connector connects the first circuit layer and the second circuit layer. The second redistribution layer is disposed over the first redistribution layer and includes a third circuit layer contacting the conductive contact. The chip is disposed over the second redistribution layer and is electrically connected with the third circuit layer.