公开(公告)号：US20210202394A1

公开(公告)日：2021-07-01

申请号：US17200892

申请日：2021-03-14

申请人： Unimicron Technology Corp.

发明人： Yi LIN ,  Chun-Ming CHIU ,  Hung-Chih LEE ,  Chang-Fu CHEN

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48

摘要： A package structure includes a first substrate, a second substrate, a plurality of dies, a plurality of first conductive elements, and a plurality of second conductive elements. The first substrate has a recessed region. The second substrate is disposed in the recessed region and protrudes from the first substrate. The dies are disposed on the first substrate and the second substrate, such that the second substrate is disposed between the first substrate and the dies. The first conductive elements are disposed between the dies and the first substrate. The dies are electrically connected with the first substrate through the first conductive elements. The second conductive elements are disposed between the dies and the second substrate. The dies are electrically connected with the second substrate through the second conductive elements.

公开(公告)号：US20190279936A1

公开(公告)日：2019-09-12

申请号：US16000912

申请日：2018-06-06

申请人： Unimicron Technology Corp.

发明人： Yi LIN ,  Chun-Ming CHIU ,  Hung-Chih LEE ,  Chang-Fu CHEN

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L25/065

摘要： A package structure includes a first substrate, a second substrate, a plurality of dies, a plurality of first conductive elements, and a plurality of second conductive elements. The first substrate has a recessed region. The second substrate is disposed in the recessed region and protrudes from the first substrate. The dies are disposed on the first substrate and the second substrate, such that the second substrate is disposed between the first substrate and the dies. The first conductive elements are disposed between the dies and the first substrate. The dies are electrically connected with the first substrate through the first conductive elements. The second conductive elements are disposed between the dies and the second substrate. The dies are electrically connected with the second substrate through the second conductive elements.