公开(公告)号：US11751426B2

公开(公告)日：2023-09-05

申请号：US15787117

申请日：2017-10-18

Applicant: Universal Display Corporation

Inventor： Siddharth Harikrishna Mohan ,  William E. Quinn ,  Arpit Patel ,  James Robert Kantor

IPC: H10K50/844 ,  H10K71/00 ,  H10K77/10 ,  H10K102/00

CPC classification number: H10K50/8445 ,  H10K71/00 ,  H10K77/111 ,  H10K2102/311 ,  H10K2102/351 ,  Y02E10/549

Abstract: A hybrid permeation barrier having two complementary layers is disclosed. The barrier includes a first layer with a relatively high stress-thickness in the range of −1000 MPa-μm to −200 MPa-μm and a second layer with a relatively low stress-thickness in the range −150 MPa-μm to 300 MPa-μm. The second layer compensates for the stress caused by the first, thereby allowing for a barrier that provides good permeation without causing failure of the device due to delamination.

公开(公告)号：US20190221771A1

公开(公告)日：2019-07-18

申请号：US16361317

申请日：2019-03-22

Applicant: Universal Display Corporation

Inventor： Siddharth Harikrishna Mohan ,  William E. Quinn ,  James Robert Kantor

IPC: H01L51/52

CPC classification number: H01L51/5253 ,  H01L2251/303

Abstract: A buffer layer is provided that can be fabricated over an OLED without the use of any oxygen-containing gas. The buffer layer reduces the possibility of damage to the underlying OLED due to use of oxygen-containing materials during deposition of subsequent barrier layers, and thereby allows for deposition of barrier layers without reducing the flexibility of the device.

公开(公告)号：US20170117503A1

公开(公告)日：2017-04-27

申请号：US15331065

申请日：2016-10-21

Applicant: Universal Display Corporation

Inventor： Siddharth Harikrishna Mohan ,  William E. Quinn ,  James Robert Kantor

IPC: H01L51/52 ,  H01L51/56

CPC classification number: H01L51/5253 ,  H01L2251/303

Abstract: A buffer layer is provided that can be fabricated over an OLED without the use of any oxygen-containing gas. The buffer layer reduces the possibility of damage to the underlying OLED due to use of oxygen-containing materials during deposition of subsequent barrier layers, and thereby allows for deposition of barrier layers without reducing the flexibility of the device.