High electron mobility transistor-based terahertz wave space external modulator
    2.
    发明授权
    High electron mobility transistor-based terahertz wave space external modulator 有权
    基于高电子迁移率晶体管的太赫兹波空间外调制器

    公开(公告)号:US09590739B2

    公开(公告)日:2017-03-07

    申请号:US14892578

    申请日:2014-05-20

    CPC classification number: H04B10/516 H04B10/501 H04B10/90

    Abstract: Terahertz external modulator based on high electron mobility transistors belongs to the field of electromagnetic functional devices technology. This invention includes the semiconductor substrate (1), the epitaxial layer (2), and the modulation-unit array (4). The epitaxial layer (2) is set on the semiconductor substrate (1). The modulation-unit (4), the positive electrode (3), and the negative electrode (5) are all set on the epitaxial layer (2). The modulation-unit array includes at least three units with each of them is composed of high electron mobility transistors and metamaterial-structure. The gates of transistors connect to the negative electrode (5), and the sources and drains connect to the positive electrode (3). This invention is used for manipulation of spatial transmission terahertz waves. It could be operated at room temperatures, normal pressures, and non-vacuum condition. It does not need to load on the waveguide, thus is easy to package and use.

    Abstract translation: 基于高电子迁移率晶体管的太赫兹外部调制器属于电磁功能器件技术领域。 本发明包括半导体衬底(1),外延层(2)和调制单元阵列(4)。 外延层(2)设置在半导体衬底(1)上。 调制单元(4),正极(3)和负极(5)全部设置在外延层(2)上。 调制单元阵列包括至少三个单元,每个单元由高电子迁移率晶体管和超材料结构组成。 晶体管的栅极连接到负极(5),源极和漏极连接到正极(3)。 本发明用于空间传输太赫兹波的操纵。 它可以在室温,正常压力和非真空条件下运行。 它不需要加载在波导上,因此易于封装和使用。

    Wideband terahertz modulator based on gradual openings

    公开(公告)号:US11822162B2

    公开(公告)日:2023-11-21

    申请号:US16856054

    申请日:2020-04-23

    CPC classification number: G02F1/015 G02F2203/13

    Abstract: A wideband terahertz modulator based on gradual openings, which belongs to the technical field of electromagnetic functional devices, includes: a semiconductor substrate; an epitaxial layer provided on the semiconductor substrate; a modulation units array, a positive voltage loading electrode and a negative voltage loading electrode which are provided on the epitaxial layer; wherein each modulation unit in the modulation units array comprises a disconnected H-shaped structure, a metal electrode located below an end of the opening of the disconnected H-shaped structure, and a semiconductor doped heterostructure located below the opening of the disconnected H-shaped structure; wherein in the disconnected H-shaped structures, adjacent modulation units have different opening positions; in a same row, the opening positions are linearly distributed and have a certain slope, and inclination slopes of the opening positions of two adjacent rows are opposite.

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