公开(公告)号：US20210398868A1

公开(公告)日：2021-12-23

申请号：US17284307

申请日：2019-10-11

Applicant: University of Southampton

Inventor： Stephen Paul BEEBY ,  Michael John TUDOR ,  Menglong LI

IPC: H01L23/31 ,  H01L23/498 ,  H01L21/56 ,  H01L25/065 ,  D02G3/44

Abstract: An encapsulated assembly of electronic componentry, suitable for incorporation into a textile or a yarn, and the assembly comprising two flexible substrates (3, 4) which encapsulate the electronic componentry, at least one of the flexible substrates comprising at least one preformed relief region (3a), which provides a volume which at least in part accommodates the electronic componentry, and the componentry located substantially at a neutral axis (N) of the assembly.