Microbial-Embedded Hydrogel Beads and Methods of Use

    公开(公告)号:US20250115528A1

    公开(公告)日:2025-04-10

    申请号:US18725318

    申请日:2023-01-05

    Abstract: Embodiments of the present disclosure provide compositions and methods for increasing nutrient uptake by plants and for effecting soil remediation. Embodiments of the composition and methods comprise a hydrogel bead, a microbial consortia, and a fungi, and can additionally comprise an excipient for administration of the hydrogel bead comprising the microbial consortia and the fungi, one or more seed, water, one or more nutrients, and combinations thereof. Such composition and methods have broad application to reduce fertilizer requirements and use, and to increase plant nutrient access and uptake. The composition and methods have additional application to remediate contaminated mediums such as soil contaminated with chemicals, petroleum, and explosives.

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