摘要:
A device for the application of a liquid substance has a baseplate, in which at least one cavity is recessed, and a container. In operation, the container and the baseplate are moved relative to each other in such a way that during the relative movement the container passes from one side of the cavity to the other side of the cavity. Such a device is particularly suitable for the application of flux, electrically conducting epoxy or soldering paste onto the bumps of a semiconductor chip.
摘要:
The present invention provides for safe and simple replacement or removal of individual feeders from a placement machine without any loss in performance by using a signal means to emit a signal to the CPU of the placement machine when a feeder is removed. Upon receipt of this signal, the CPU controls the pick-up head in such a way so that it does not collide with the feeder being removed. If the pick-up head is located directly above the pick-up position of the feeder to be removed, it can be moved momentarily upwards or sideways thanks to its fast drive before a collision occurs. If the pick-up head is located just on the way to the pick-up position of the feeder, the procedure is momentarily aborted so that a collision can be avoided.
摘要:
Supply of tape components in which a tape replacement can be performed without any loss in performance is provided for by unwinding a first tape from a first reel, moving components located in the pockets of said first tape to a pickup position where they are picked up by a placement machine, splicing the end of said first tape to the start of a second tape wound on a second reel, and replacing said first reel by said second reel. A splice sensor is included for detecting a splice between the first and second tape. The signals from such splice sensor allow for an automatic and synchronous take over of the related data of the newly joined second tape.