Laser Processing Machines and Methods
    1.
    发明申请
    Laser Processing Machines and Methods 审中-公开
    激光加工机和方法

    公开(公告)号:US20110253686A1

    公开(公告)日:2011-10-20

    申请号:US13086813

    申请日:2011-04-14

    IPC分类号: B23K26/00 B23P23/00

    摘要: The invention relates to a laser processing machine for selectively processing plate-like or pipe-like workpieces, including: a displacement device to which a workpiece table for supporting a plate-like workpiece can be secured in order to move the workpiece table into and out of a processing range of the laser processing machine and a handling device for handling a pipe-like workpiece when the pipe-like workpiece is processed in the processing range, the handling device having at least one support device for supporting the pipe-like workpiece during the processing operation. The support device can be moved in a controlled manner in the longitudinal direction (X) of the pipe-like workpiece over at least 20% of the processing range. The invention also relates to methods for retrofitting laser processing machines from processing plate-like workpieces to processing pipe-like workpieces.

    摘要翻译: 本发明涉及一种用于选择性地处理板状或管状工件的激光加工机,包括:位移装置,用于支撑板状工件的工件台可以固定到该移动装置上,以便将工件台移入和移出 所述激光加工机的处理范围以及在所述处理范围内处理所述管状工件时处理管状工件的处理装置,所述搬运装置具有至少一个支撑所述管状工件的支撑装置 处理操作。 支撑装置可以在管状工件的纵向(X)上以受控的方式在至少处理范围的20%的范围内移动。 本发明还涉及用于将激光加工机器从加工板状工件加工成加工管状工件的方法。