公开(公告)号：US20220085219A1

公开(公告)日：2022-03-17

申请号：US17474884

申请日：2021-09-14

申请人： Utica Leaseco, LLC

发明人： James G. NEFF ,  Paul E. SIMS

IPC分类号： H01L31/02 ,  H01L31/05 ,  H01L31/18

摘要： A photovoltaic device may include a flexible diode circuit having one or more bypass diodes mounted to one or more semiconductor layers using surface mount technology (SMT). The bypass diode and the one or more of the semiconductor layers may allow the flexible diode circuit to be manufactured as a thin, flexible ribbon, thereby providing efficiency in manufacturing and storing of the flexible diode circuit and/or the photovoltaic device, and also increasing a packing factor and areal power of the photovoltaic device, as compared to a typical photovoltaic device.