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公开(公告)号:US10707099B2
公开(公告)日:2020-07-07
申请号:US15496755
申请日:2017-04-25
IPC分类号: H01L21/67 , B01D46/00 , B08B3/14 , B08B15/02 , H01L21/687
摘要: The wafer processing system includes a rotatable wafer support member for supporting a wafer and a plurality of collections trays disposed about a peripheral edge of the wafer support member. The collection trays are arranged in a stacked configuration, each collection tray having an inner wall portion and an outer wall portion that converge to define a trough section for collecting fluid. The system includes a chamber exhaust outlet that is formed in the housing for venting gas from the interior of the housing outside of the collection trays and a chemical exhaust outlet that is formed in the housing for venting gas that flows through the collection chamber to the chemical exhaust outlet. The chemical exhaust outlet is fluidly isolated from the chamber exhaust outlet.
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公开(公告)号:US11342215B2
公开(公告)日:2022-05-24
申请号:US15960075
申请日:2018-04-23
IPC分类号: H01L21/687 , H01L21/67 , B08B3/02 , H01L21/683 , B08B3/14 , H01L21/673
摘要: A housing of a wafer processing system includes at least one chamber exhaust outlet and at least one chemical exhaust outlet. The chamber exhaust outlet is formed in the housing for venting gas from the interior of the housing and the chemical exhaust outlet is formed in the housing for venting gas that flows along at least one of: (a) a first flow path defined between the splash shield in a raised position and the collection trays in the lowered position; and (b) a second flow path in which the gas flows through the collection chamber to the chemical exhaust outlet.
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