Systems and methods for cutting and cooking a substance

    公开(公告)号:US10765133B1

    公开(公告)日:2020-09-08

    申请号:US16819610

    申请日:2020-03-16

    Abstract: Systems and methods for cutting and cooking a substance are disclosed. Exemplary implementations may: convey, via a primary conveying subsystem, a layer of food substance along a conveyance path; cut, via a cutter, the layer of food substance into food pieces; apply, via a primary pressurized fluid outlet, primary pressurized fluid such that the food pieces are released from the cutter; apply, via a secondary pressurized fluid outlet positioned above the primary conveying substrate and pointed toward the primary conveying substrate, secondary pressurized fluid so that the food pieces are held flat to a primary conveying substrate; heat, via a heating mechanism, air within a chamber to provide an environment suitable for dehydrating the food pieces passing through the chamber; and convey the food pieces for at least a portion of the conveyance path through the chamber and hold the food pieces flat with a secondary conveying subsystem.

    SYSTEMS AND METHODS FOR CUTTING AND COOKING A SUBSTANCE

    公开(公告)号:US20210076717A1

    公开(公告)日:2021-03-18

    申请号:US16951364

    申请日:2020-11-18

    Abstract: Systems and methods for cutting and cooking a substance are disclosed. Exemplary implementations may: convey, via a primary conveying subsystem, a layer of food substance along a conveyance path along which the layer of food substance is conveyed; cut, via a cutter, the layer of food substance into food pieces; apply, via a primary pressurized fluid outlet, primary pressurized fluid such that the food pieces are released from the cutter; heat, via the heating mechanism, a chamber; apply, via a secondary pressurized fluid outlet, secondary pressurized fluid so that the food pieces are held flat to the primary conveying substrate, and hold, via a secondary conveying subsystem, the layer of food substance flat between the primary conveying substrate and a secondary conveying substrate for at least a portion of the chamber.

    Systems and methods for cutting and cooking a substance

    公开(公告)号:US11596164B2

    公开(公告)日:2023-03-07

    申请号:US16951364

    申请日:2020-11-18

    Abstract: Systems and methods for cutting and cooking a substance are disclosed. Exemplary implementations may: convey, via a primary conveying subsystem, a layer of food substance along a conveyance path along which the layer of food substance is conveyed; cut, via a cutter, the layer of food substance into food pieces; apply, via a primary pressurized fluid outlet, primary pressurized fluid such that the food pieces are released from the cutter; heat, via the heating mechanism, a chamber; apply, via a secondary pressurized fluid outlet, secondary pressurized fluid so that the food pieces are held flat to the primary conveying substrate, and hold, via a secondary conveying subsystem, the layer of food substance flat between the primary conveying substrate and a secondary conveying substrate for at least a portion of the chamber.

    SYSTEMS AND METHODS FOR CUTTING AND COOKING A SUBSTANCE

    公开(公告)号:US20200367539A1

    公开(公告)日:2020-11-26

    申请号:US16937075

    申请日:2020-07-23

    Abstract: Systems and methods for cutting and cooking a substance are disclosed. Exemplary implementations may: convey, via a primary conveying subsystem, a layer of food substance along a conveyance path along which the layer of food substance is conveyed; cut, via a cutter, the layer of food substance into food pieces; apply, via a primary pressurized fluid outlet, primary pressurized fluid such that the food pieces are released from the cutter; heat, via the heating mechanism, a chamber; apply, via a secondary pressurized fluid outlet, secondary pressurized fluid so that the food pieces are held flat to the primary conveying substrate, and hold, via a secondary conveying subsystem, the layer of food substance flat between the primary conveying substrate and a secondary conveying substrate for at least a portion of the chamber.

Patent Agency Ranking