公开(公告)号：US20240105874A1

公开(公告)日：2024-03-28

申请号：US18355586

申请日：2023-07-20

申请人： VIAVI SOLUTIONS INC.

发明人： Michael VERDUN ,  Pierrick JACQUY

IPC分类号： H01L31/107 ,  H01L31/024

CPC分类号： H01L31/107 ,  H01L31/024

摘要： In some examples, a photodiode module may include a photodiode chip, a submount located adjacent to the photodiode chip, and a heating element to heat the photodiode chip. By increasing the temperature of the photodiode chip through use of the heating element, the cutoff wavelength of the photodiode chip may be increased, which may also increase the quantum efficiency and the recovery time of the photodiode chip.