公开(公告)号：US10321593B1

公开(公告)日：2019-06-11

申请号：US15487429

申请日：2017-04-13

Applicant: VORBECK MATERIALS CORP.

Inventor： John S. Lettow ,  Louise Brooks ,  Paige J. Boehmcke ,  Bretton Swope ,  Robyn Nariyoshi

IPC: H05K5/00 ,  H05K5/02 ,  H05K1/02 ,  H01Q1/27

Abstract: Generally speaking, pursuant to various embodiments, interconnect apparatuses are provided herein to couple flexible circuits to control circuits. In some embodiments, the apparatus can include a first portion housing one or more control circuits and a second portion conductively coupled to a flexible circuit. In some embodiments, the first portion may be configured to be coupled to the second portion such that the control circuit can be conductively coupled to the flexible circuit when the first portion is coupled to the second portion. In some embodiments, the control circuit can be configured to capture temperature readings. In some embodiments, the control circuit can be configured to capture proximity readings. In some embodiments, the control circuit can be configured to include one or more communications devices.