Resilient antenna securing mechanism

    公开(公告)号:US11431075B2

    公开(公告)日:2022-08-30

    申请号:US17148846

    申请日:2021-01-14

    申请人: Veea Inc.

    IPC分类号: H01Q1/20 H01Q1/12 H01Q1/38

    摘要: A resilient antenna securing device that includes a frame structure and a plurality of fin components projecting outwardly from the frame structure. The fin components are configured to receive and hold one or more RF antenna portions. Each fin of a first pair of the plurality of fins components includes a tab that extends toward the other fin of the first pair of fins. At least one first intermediate fin of the plurality of fins is disposed between the first pair of fins. The tabs from the first pair of fins together trap a first RF antenna portion between the tabs and the at least one first intermediate fin.

    Integrated Heatsink and Antenna Structure

    公开(公告)号:US20210175596A1

    公开(公告)日:2021-06-10

    申请号:US17110744

    申请日:2020-12-03

    申请人: Veea Inc.

    IPC分类号: H01Q1/02 H01Q1/44

    摘要: An integrated heatsink and antenna structure that is suitable for inclusion in small and midsized computing devices. The integrated heatsink and antenna structure may include heatsink portions and radio frequency antenna portions. The heatsink portions may provide a path for dissipating thermal energy or heat generated by the components in the device (e.g., printed circuit boards, processors, voltage amplifiers, etc.), and the radio frequency (RF) antenna portions may allow the device to send and receive wireless communications. The integrated heatsink and antenna structure may be formed so that radio frequency antenna portions operate to improve the thermal performance of the heatsink portions and/or so that the heatsink portions operate to improve the antenna properties (e.g., radiation patterns, radiation efficiency, bandwidth, input impedance, polarization, directivity, gain, beam-width, voltage standing wave ratio, etc.) of the radio frequency antenna portions.

    Module identification method for expandable gateway applications

    公开(公告)号:US11641413B2

    公开(公告)日:2023-05-02

    申请号:US17577642

    申请日:2022-01-18

    申请人: Veea Inc.

    IPC分类号: H04M1/02 H04W88/08

    摘要: A modular wireless communications system (edge device, etc.) that includes a base unit having a base unit processor and one or more additional units that each include a processor, in which the base unit processor is configured with processor-executable software instructions to determine whether the base unit has been combined with the one or more additional units to create a combined unit and/or whether one or more of the additional units have been detached from the combined unit. The processor may automatically perform an edge reconfiguration interrogation and enumeration (ERIE) operation in response to determining that the base unit has been combined with the one or more additional units to create the combined unit or in response to determining that one or more of the additional units have been detached from the combined unit.

    Integrated Heatsink and Antenna Structure

    公开(公告)号:US20230126145A1

    公开(公告)日:2023-04-27

    申请号:US18086069

    申请日:2022-12-21

    申请人: VEEA Inc.

    IPC分类号: H01Q1/02 H01Q1/44

    摘要: An integrated heatsink and antenna structure that is suitable for inclusion in small and midsized computing devices. The integrated heatsink and antenna structure may include a plurality of fin components that dissipate thermal energy integrated into a heatsink base and a plurality of radio frequency antenna portions coupled to and surrounded by the fin components. The plurality of radio frequency antenna portions may form a monopole antenna. The heatsink base may operate as a ground reference for each of the plurality of the antenna portions and to improve an omnidirectional pattern of each of the plurality of the antenna portions.

    Integrated heatsink and antenna structure

    公开(公告)号:US11563262B2

    公开(公告)日:2023-01-24

    申请号:US17110744

    申请日:2020-12-03

    申请人: Veea Inc.

    IPC分类号: H01Q1/02 H01Q1/20 H01Q1/44

    摘要: An integrated heatsink and antenna structure that is suitable for inclusion in small and midsized computing devices. The integrated heatsink and antenna structure may include heatsink portions and radio frequency antenna portions. The heatsink portions may provide a path for dissipating thermal energy or heat generated by the components in the device (e.g., printed circuit boards, processors, voltage amplifiers, etc.), and the radio frequency (RF) antenna portions may allow the device to send and receive wireless communications. The integrated heatsink and antenna structure may be formed so that radio frequency antenna portions operate to improve the thermal performance of the heatsink portions and/or so that the heatsink portions operate to improve the antenna properties (e.g., radiation patterns, radiation efficiency, bandwidth, input impedance, polarization, directivity, gain, beam-width, voltage standing wave ratio, etc.) of the radio frequency antenna portions.

    Method and procedure for miniaturing a multi-layer PCB

    公开(公告)号:US11523502B2

    公开(公告)日:2022-12-06

    申请号:US17313073

    申请日:2021-05-06

    申请人: Veea Inc.

    IPC分类号: H05K1/02

    摘要: A multiple layer printed circuit board (PCB) in which the cores (or core layers) are removed and replaced with prepreg layers, which provide structure integrity for the PCB. Such a multi-layer PCB may include a plurality of layers that include a plurality of signal layers, a plurality of ground plane layers, a plurality of inner signal layers, and a single core substrate layer. Each layer in the plurality of layers may be separated from every other layer in the plurality of layers by at least one prepreg substrate layer.

    Module identification method for expandable gateway applications

    公开(公告)号:US11258889B2

    公开(公告)日:2022-02-22

    申请号:US17158266

    申请日:2021-01-26

    申请人: Veea Inc.

    IPC分类号: H04M1/02 H04W88/08

    摘要: A modular wireless communications system (edge device, etc.) that includes a base unit having a base unit processor and one or more additional units that each include a processor, in which the base unit processor is configured with processor-executable software instructions to determine whether the base unit has been combined with the one or more additional units to create a combined unit and/or whether one or more of the additional units have been detached from the combined unit. The processor may automatically perform an edge reconfiguration interrogation and enumeration (ERIE) operation in response to determining that the base unit has been combined with the one or more additional units to create the combined unit or in response to determining that one or more of the additional units have been detached from the combined unit.

    Module Identification Method for Expandable Gateway Applications

    公开(公告)号:US20210243286A1

    公开(公告)日:2021-08-05

    申请号:US17158266

    申请日:2021-01-26

    申请人: Veea Inc.

    IPC分类号: H04M1/02

    摘要: A modular wireless communications system (edge device, etc.) that includes a base unit having a base unit processor and one or more additional units that each include a processor, in which the base unit processor is configured with processor-executable software instructions to determine whether the base unit has been combined with the one or more additional units to create a combined unit and/or whether one or more of the additional units have been detached from the combined unit. The processor may automatically perform an edge reconfiguration interrogation and enumeration (ERIE) operation in response to determining that the base unit has been combined with the one or more additional units to create the combined unit or in response to determining that one or more of the additional units have been detached from the combined unit.