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公开(公告)号:US20180102266A1
公开(公告)日:2018-04-12
申请号:US15290237
申请日:2016-10-11
CPC分类号: H01L21/67126 , F16J15/022 , F16J15/025 , H01L21/6719
摘要: A seal having a cross-sectional profile that includes a first lobe, a second lobe, and a corner having an angle between 45 and 90 degrees, inclusive, a first side extending from the first lobe to the corner and a second side extending from the second lobe to the corner, where the first side and the second side define the corner angle. The seal can be seated in a groove so that the first lobe and the corner are in the groove and the second lobe extends from the groove. In use, the second lobe folds into the groove to form a fluid-tight seal.
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公开(公告)号:USD803283S1
公开(公告)日:2017-11-21
申请号:US29564740
申请日:2016-05-16
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公开(公告)号:US10269595B2
公开(公告)日:2019-04-23
申请号:US15290237
申请日:2016-10-11
摘要: A seal having a cross-sectional profile that includes a first lobe, a second lobe, and a corner having an angle between 45 and 90 degrees, inclusive, a first side extending from the first lobe to the corner and a second side extending from the second lobe to the corner, where the first side and the second side define the corner angle. The seal can be seated in a groove so that the first lobe and the corner are in the groove and the second lobe extends from the groove. In use, the second lobe folds into the groove to form a fluid-tight seal.
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公开(公告)号:US20170256436A1
公开(公告)日:2017-09-07
申请号:US15057530
申请日:2016-03-01
IPC分类号: H01L21/687 , B25J15/00 , B25J11/00 , H01L21/683
CPC分类号: H01L21/68742 , B25J11/0095 , B25J15/0042 , B25J15/0616 , B25J15/10 , H01L21/6838 , H01L21/68728 , H01L21/68785
摘要: A wafer handing assembly comprising a center hub supporting a vertical non-contact lifting head and at least one radially extending and radially retracting wafer engaging mechanism having a surface to engage a wafer at a peripheral edge of the wafer, where the peripheral edge is a corner edge or a side edge. In some implementations, the wafer engaging mechanism has a foot on which the wafer edge is supported.
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公开(公告)号:US20170256434A1
公开(公告)日:2017-09-07
申请号:US15377230
申请日:2016-12-13
IPC分类号: H01L21/687
CPC分类号: H01L21/68735 , H01L21/6838 , H01L21/68728 , H01L21/68742 , H01L21/68785
摘要: A wafer handling assembly comprising a center hub supporting a vertical non-contact lifting head and at least one radially extending and radially retracting wafer engaging mechanism having a surface to engage a wafer at a peripheral edge of the wafer, where the peripheral edge is a corner edge or a side edge. In some implementations, the wafer engaging mechanism has a foot on which the wafer edge is supported. The lifting head may be vertically moveable in respect to the assembly.
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