公开(公告)号：USD921431S1

公开(公告)日：2021-06-08

申请号：US29685939

申请日：2019-04-01

Applicant: Veeco Instruments, Inc.

Designer： Sandeep Krishnan ,  Bojan Mitrovic ,  Aniruddha Bagchi ,  Alexander Gurary ,  Chenghung Paul Chang ,  Ian Kunsch ,  Matthew J. Van Doren

公开(公告)号：US20230060609A1

公开(公告)日：2023-03-02

申请号：US17462990

申请日：2021-08-31

Applicant: Veeco Instruments Inc.

Inventor： Sandeep Krishnan ,  Bojan Mitrovic ,  Eric A. Armour ,  Yuliy Rashkovsky ,  Robert S. Maxwell, IV ,  Matthew J. Van Doren

IPC: H01L21/677 ,  H01L21/205 ,  H01L21/687 ,  C23C16/46

Abstract: A wafer carrier assembly as described herein improves thermal control across a top surface thereof to maintain highly controlled deposition locations and thicknesses.