Apparatus for rapid filling of a processing volume
    1.
    发明授权
    Apparatus for rapid filling of a processing volume 失效
    用于快速填充处理量的装置

    公开(公告)号:US07950407B2

    公开(公告)日:2011-05-31

    申请号:US11672254

    申请日:2007-02-07

    IPC分类号: B67D3/00

    摘要: A method and apparatus for supplying greater fluid flow and/or fluid volume from a fluid provided from a facility source to a substrate processing chamber is provided. The apparatus couples to an existing facility fluid source and accumulates the fluid, and the flow characteristics of the accumulated fluid are enhanced for delivery to the processing chamber. The apparatus includes a tank in fluid communication with the facility source and one or more processing chambers, and a valve disposed between the tank and the processing chambers adapted to receive a signal from a controller to facilitate filling or draining of the tank. The apparatus and method affects cost of ownership by altering the pressure and/or volume of the existing facility source without the need to alter the facility source.

    摘要翻译: 提供了一种用于从从设备源提供到衬底处理室的流体提供更大的流体流动和/或流体体积的方法和装置。 该装置耦合到现有的设备流体源并且积聚流体,并且增强了累积流体的流动特性以便输送到处理室。 该设备包括与设备源和一个或多个处理室流体连通的罐,以及设置在罐和处理室之间的阀,适于从控制器接收信号以便于罐的填充或排放。 该设备和方法通过改变现有设施来源的压力和/或体积来影响所有权成本,而不需要改变设施来源。

    TUNABLE MEGASONICS CAVITATION PROCESS USING MULTIPLE TRANSDUCERS FOR CLEANING NANOMETER PARTICLES WITHOUT STRUCTURE DAMAGE
    2.
    发明申请
    TUNABLE MEGASONICS CAVITATION PROCESS USING MULTIPLE TRANSDUCERS FOR CLEANING NANOMETER PARTICLES WITHOUT STRUCTURE DAMAGE 审中-公开
    使用多个传感器进行清洁微粒渗透处理的方法,用于清洁没有结构损伤的纳米颗粒

    公开(公告)号:US20080163890A1

    公开(公告)日:2008-07-10

    申请号:US11971412

    申请日:2008-01-09

    IPC分类号: B08B3/12

    CPC分类号: H01L21/02096 C11D11/007

    摘要: A method and system for cleaning a substrate is provided. More particularly systems and methods that allows for precise tailoring of megasonics distribution at a substrate surface to be above the threshold required for particle removal efficiency (PRE), yet below the value which causes structural damage are provided. This method utilizes multiple megasonics transducers operated at very low power densities in a single substrate immersion processor. This method is shown to produce high cleaning efficiencies without damage to 45 nm devices. Further, sonoluminescence studies demonstrate that the transducers are operated in the single bubble sonoluminescence (SBSL) regime, well below the cavitation threshold for transient multiple-bubble sonoluminescence (MBSL).

    摘要翻译: 提供了一种清洗基板的方法和系统。 更具体地,提供允许精确定制在衬底表面处的兆声道分布高于颗粒去除效率(PRE)所需阈值但低于导致结构损坏的值的系统和方法。 该方法利用在单个衬底浸入式处理器中以非常低功率密度运行的多个兆声换能器。 这种方法被证明可以产生高清洁效率而不损坏45nm器件。 此外,声致发光研究表明,换能器在单气泡声发光(SBSL)方式下运行,远低于瞬态多气泡声发光(MBSL)的空化阈值。