公开(公告)号：US20200381223A1

公开(公告)日：2020-12-03

申请号：US15733514

申请日：2019-03-07

Applicant: View, Inc.

Inventor： Bo Neilan ,  Michael Potter ,  Dhairya Shrivastava

IPC: H01J37/32 ,  H01L21/677 ,  C23C14/34 ,  H01L21/673 ,  C23C14/56 ,  C23C14/50

Abstract: Various embodiments herein relate to carriers for supporting one or more substrate as the substrates are passed through a processing apparatus. In many cases, the substrates are oriented in a vertical manner The carrier may include a frame and vertical support bars that secure the glass to the frame. The carrier may lack horizontal support bars. The carrier may allow for thermal expansion and contraction of the substrates, without any need to provide precise gaps between adjacent pairs of substrates. The carriers described herein substantially reduce the risk of breaking the processing apparatus and substrates, thereby achieving a more efficient process. Certain embodiments herein relate to methods of loading substrates onto a carrier.

公开(公告)号：US11424109B2

公开(公告)日：2022-08-23

申请号：US15733514

申请日：2019-03-07

Applicant: View, Inc.

Inventor： Bo Neilan ,  Michael Potter ,  Dhairya Shrivastava

IPC: H01J37/32 ,  H01L21/677 ,  H01L21/673 ,  C23C14/56 ,  C23C14/50 ,  C23C14/34

Abstract: Various embodiments herein relate to carriers for supporting one or more substrate as the substrates are passed through a processing apparatus. In many cases, the substrates are oriented in a vertical manner The carrier may include a frame and vertical support bars that secure the glass to the frame. The carrier may lack horizontal support bars. The carrier may allow for thermal expansion and contraction of the substrates, without any need to provide precise gaps between adjacent pairs of substrates. The carriers described herein substantially reduce the risk of breaking the processing apparatus and substrates, thereby achieving a more efficient process. Certain embodiments herein relate to methods of loading substrates onto a carrier.

公开(公告)号：US12068142B2

公开(公告)日：2024-08-20

申请号：US18195887

申请日：2023-05-10

Applicant: View, Inc.

Inventor： Bo Neilan ,  Michael Potter ,  Dhairya Shrivastava

IPC: H01J37/32 ,  C23C14/34 ,  C23C14/50 ,  C23C14/56 ,  H01L21/673 ,  H01L21/677

CPC classification number: H01J37/32715 ,  C23C14/34 ,  C23C14/50 ,  C23C14/562 ,  C23C14/568 ,  H01J37/32651 ,  H01J37/32779 ,  H01L21/6734 ,  H01L21/67712 ,  H01L21/6776 ,  H01J2237/026 ,  H01J2237/2007 ,  H01J2237/20221 ,  H01J2237/332

Abstract: Various embodiments herein relate to carriers for supporting one or more substrate as the substrates are passed through a processing apparatus. In many cases, the substrates are oriented in a vertical manner. The carrier may include a frame and vertical support bars that secure the glass to the frame. The carrier may lack horizontal support bars. The carrier may allow for thermal expansion and contraction of the substrates, without any need to provide precise gaps between adjacent pairs of substrates. The carriers described herein substantially reduce the risk of breaking the processing apparatus and substrates, thereby achieving a more efficient process. Certain embodiments herein relate to methods of loading substrates onto a carrier.

公开(公告)号：US20250014873A1

公开(公告)日：2025-01-09

申请号：US18770976

申请日：2024-07-12

Applicant: View, Inc.

Inventor： Bo Neilan ,  Michael Potter ,  Dhairya Shrivastava

IPC: H01J37/32 ,  C23C14/34 ,  C23C14/50 ,  C23C14/56 ,  H01L21/673 ,  H01L21/677

Abstract: Various embodiments herein relate to carriers for supporting one or more substrate as the substrates are passed through a processing apparatus. In many cases, the substrates are oriented in a vertical manner. The carrier may include a frame and vertical support bars that secure the glass to the frame. The carrier may lack horizontal support bars. The carrier may allow for thermal expansion and contraction of the substrates, without any need to provide precise gaps between adjacent pairs of substrates. The carriers described herein substantially reduce the risk of breaking the processing apparatus and substrates, thereby achieving a more efficient process. Certain embodiments herein relate to methods of loading substrates onto a carrier.