Glass-modified stress waves for separation of ultra thin films and nanoelectronics device fabrication
    1.
    发明授权
    Glass-modified stress waves for separation of ultra thin films and nanoelectronics device fabrication 有权
    用于分离超薄膜和纳米电子器件制造的玻璃修饰应力波

    公开(公告)号:US07487684B2

    公开(公告)日:2009-02-10

    申请号:US11504981

    申请日:2006-08-15

    IPC分类号: G01L1/24

    摘要: A device for generating a tensile force between a substrate and a coating, wherein the substrate has a thickness defined by a first side and a second side in a first axis, and the coating is applied to the first side of the substrate such that the coating and substrate are axially spaced along the first axis in intimate facing contact with each other to form a coating/substrate interface. The apparatus has a glass element disposed on the second side of the substrate and axially spaced along the first axis. The glass element is configured to propagate a stress wave to the coating/substrate interface to generate a tensile force between the substrate and the coating.

    摘要翻译: 一种用于在基板和涂层之间产生张力的装置,其中所述基板具有由第一轴线的第一侧和第二侧限定的厚度,并且将所述涂层施加到所述基板的第一侧,使得所述涂层 并且衬底沿着第一轴线轴向间隔开,彼此紧密地面对接触以形成涂层/衬底界面。 该装置具有设置在基板的第二侧上的玻璃元件并且沿第一轴线轴向间隔开。 玻璃元件构造成将应力波传播到涂层/基底界面以在基底和涂层之间产生张力。