公开(公告)号：US20130062730A1

公开(公告)日：2013-03-14

申请号：US13608880

申请日：2012-09-10

申请人： Vincenzo PALUMBO ,  Dario PACI ,  Paolo IULIANO ,  Fausto CARACE ,  Marco MORELLI

发明人： Vincenzo PALUMBO ,  Dario PACI ,  Paolo IULIANO ,  Fausto CARACE ,  Marco MORELLI

IPC分类号： H01L27/08 ,  H01L21/02

CPC分类号： H01L23/5227 ,  H01L23/645 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

摘要： An embodiment of an electronic device includes first and second semiconductor bodies. The first semiconductor body houses a first conductive strip having a first end portion and a second end portion, and houses a first conduction terminal electrically coupled to the first end portion and facing a surface of the first semiconductor body. The second semiconductor body houses a second conductive strip having a third end portion and a fourth end portion, and houses a second conduction terminal electrically coupled to the third end portion and facing a surface of the second semiconductor body. The first and second semiconductor bodies are arranged relative to one another so that the respective surfaces face one another, and the first conduction terminal and the second conduction terminal are coupled to one another by means of a conductive element so as to form a loop of an inductor.

摘要翻译： 电子设备的实施例包括第一和第二半导体本体。 第一半导体体容纳具有第一端部和第二端部的第一导电带，并且容纳电耦合到第一端部并面向第一半导体本体的表面的第一导电端子。 第二半导体体容纳具有第三端部和第四端部的第二导电带，并且容纳与第三端部电耦合并面向第二半导体本体的表面的第二导电端子。 第一和第二半导体本体相对于彼此布置，使得各个表面彼此面对，并且第一导电端子和第二导电端子通过导电元件彼此耦合以形成环路 电感。