公开(公告)号：US20190310859A1

公开(公告)日：2019-10-10

申请号：US15945481

申请日：2018-04-04

Applicant: Visteon Global Technologies, Inc.

Inventor： Thomas Kopfstedt ,  Kai Wang ,  Thorsten Wilmer

IPC: G06F9/4401 ,  G06F3/06 ,  H03M7/30

Abstract: A system for an accelerated startup including a primary processing core of a computer, a plurality of secondary processing cores of the computer, connected to the primary processing core, and a non-volatile memory connected to the primary processing core and to the plurality of secondary processing cores. The system may include a non-volatile memory may include an initial program load and an initial RAM disk containing a compressed operating system kernel image, where the primary core decompresses the operating system kernel image upon execution of the initial program load. The system may include a plurality of compressed RAM disks, where the plurality of compressed RAM discs may be decompressed in parallel by the secondary processing cores. The system may include applications stored on the plurality of RAM discs that may be executed in parallel by the secondary processing cores after the decompression in parallel has been completed.

公开(公告)号：US20190293795A1

公开(公告)日：2019-09-26

申请号：US15927462

申请日：2018-03-21

Applicant: Visteon Global Technologies, Inc.

Inventor： Thorsten Wilmer ,  Giang-Nam Nguyen ,  Kai Wang

IPC: G01S17/89 ,  G01S7/481 ,  G01S17/06

Abstract: A LIDAR system includes a laser projecting a first beam of laser light upon a spatial light modulator, such as a liquid crystal on silicon (LCOS) device, to project a second beam having a pattern of points of relatively high intensity separated from one another by regions of relatively low intensity. A first camera having a first field of view and generates an image signal of the pattern of points of the second beam overlaid upon an image of one or more objects within the first field of view. A picture creation module generates the pattern of points and communicates it to the spatial light modulator. An image processing module detects the position and distance of the one or more objects using the image signal. The picture creation module may generate one of a plurality of different patterns to increase the spatial resolution of the LIDAR system.

公开(公告)号：US10720720B2

公开(公告)日：2020-07-21

申请号：US16358184

申请日：2019-03-19

Applicant: Visteon Global Technologies, Inc.

Inventor： Thorsten Wilmer ,  Thomas Kopfstedt ,  Kai Wang

IPC: H01R12/00 ,  H01R12/73 ,  H05K1/18 ,  H05K1/11 ,  H05K1/14

Abstract: Various systems may benefit from suitable arrangements and configurations of modules. For example, certain electronics systems may benefit from systems and methods for stacking electronic modules on a base board. A system of stacking computer modules can include a base board, which can be a printed circuit board (PCB). The system can also include a first plurality of connectors, mounted to and in electrical communication with the base board. The system can further include a first module, the first module including a second PCB and a second plurality of bottom connectors configured to engage the first plurality of connectors and a third plurality of top connectors. The system can additionally include a second module, the second module including a third PCB and a fourth plurality of bottom connectors configured to engage the third plurality of top connectors of the first module.

公开(公告)号：US20190288423A1

公开(公告)日：2019-09-19

申请号：US16358184

申请日：2019-03-19

Applicant: Visteon Global Technologies, Inc.

Inventor： Thorsten WILMER ,  Thomas Kopfstedt ,  Kai Wang

IPC: H01R12/73 ,  H05K1/18 ,  H05K1/14 ,  H05K1/11

Abstract: Various systems may benefit from suitable arrangements and configurations of modules. For example, certain electronics systems may benefit from systems and methods for stacking electronic modules on a base board. A system of stacking computer modules can include a base board, which can be a printed circuit board (PCB). The system can also include a first plurality of connectors, mounted to and in electrical communication with the base board. The system can further include a first module, the first module including a second PCB and a second plurality of bottom connectors configured to engage the first plurality of connectors and a third plurality of top connectors. The system can additionally include a second module, the second module including a third PCB and a fourth plurality of bottom connectors configured to engage the third plurality of top connectors of the first module.