公开(公告)号：US20230280440A1

公开(公告)日：2023-09-07

申请号：US17894991

申请日：2022-08-24

Applicant: Vorbeck Materials Corp.

Inventor： JOHN LETTOW ,  SRIRAM MANIVANNAN ,  Dan Scheffer ,  James Allen Turney ,  Christie Burrow ,  Samarpita Chowdhury ,  Victor Contreras ,  TRENTICE BOLAR

IPC: G01S5/06 ,  H01Q1/52 ,  H01Q1/02 ,  H01Q1/27

CPC classification number: G01S5/06 ,  H01Q1/526 ,  H01Q1/02 ,  H01Q1/273

Abstract: Embodiments relate to a communications node that includes an interfacing plate assembly; an antenna assembly; a board mounting assembly; a housing; and an enclosure. The housing includes the antenna assembly and the board mounting assembly. The enclosure is a rigid, open ended, sleeve structure that selectively receives the housing and thereby encloses the antenna assembly and the board mounting assembly therein. An interfacing plate assembly is positioned at a second end. The interfacing plate includes an input device coupled to the control circuit that receives user operational input. The antenna assembly includes an antenna frame that includes the antenna elements and orients the antenna elements in each nodal cardinal direction. The board mounting assembly includes the communication device and the control circuit that are positioned proximate to a plate. The plate is coupled to the first end opposite the interfacing plate and thermally coupled to the control circuit.