公开(公告)号：US20210375572A1

公开(公告)日：2021-12-02

申请号：US17288084

申请日：2019-10-21

Applicant: WASEDA UNIVERSITY ,  MEIDENSHA CORPORATION

Inventor： Suguru NODA ,  Sae KITAGAWA ,  Kotaro YASUI ,  Hisashi SUGIME ,  Daizo TAKAHASHI ,  Yuichi NISHIKIORI ,  Hayato OCHI ,  Rena TAKAHASHI ,  Toshimasa FUKAI

IPC: H01J9/02 ,  H01J1/304 ,  H01J35/06

Abstract: It is a CNT device (1) (carbon-metal structure) equipped with a carbon nanotube layer (2) (CNT layer 2; same hereafter) on a metal pedestal (4). The metal pedestal (4) is brazed to the CNT layer (2) with a brazing material layer (3) interposed therebetween. When manufacturing the CNT device (1), firstly, the CNT layer (2) is formed on a heat-resistant textured substrate (6). Next, the metal pedestal (4) is brazed to the CNT layer (2) that is on the heat-resistant textured substrate (6) with the brazing material layer (3) interposed therebetween. Then, the metal pedestal (4) (and the CNT layer 2) is peeled off the heat-resistant textured substrate (6) to transfer the CNT layer (2) from the heat-resistant textured substrate (6) to the metal pedestal (4).