公开(公告)号：US20120014589A1

公开(公告)日：2012-01-19

申请号：US13028157

申请日：2011-02-15

Applicant: CHIH-YANG LIN ,  WEI-CHIANG LEE

Inventor： CHIH-YANG LIN ,  WEI-CHIANG LEE

IPC: G06K9/00

CPC classification number: G01R31/046 ,  G01R1/0408 ,  G01R31/305 ,  G01R31/308

Abstract: A method uses a time domain reflectometer (TDR) to determine unqualified clasps of a peripheral component interconnect (PCI) socket. A scanning electron microscope (SEM) captures an image of an unqualified clasp and magnifies the image from a nanometer scale to view the unqualified clasp. An electron spectroscopy for chemical analysis (ESCA) obtains a degree of oxidation at each position of the unqualified clasp in response to a determination that the unqualified clasp is oxidated. A Fourier transform infrared spectroscopy (FTIR) displays a position of the soldering flux using in response to the determination that the unqualified clasp comprises the soldering flux.

Abstract translation: 一种方法使用时域反射计（TDR）来确定外围组件互连（PCI）插座的不合格卡扣。 扫描电子显微镜（SEM）捕获不合格扣钩的图像，并从纳米级放大图像以观察不合格的扣环。 响应于确定不合格的表扣被氧化，化学分析的电子能谱（ESCA）在不合格的表扣的每个位置获得一定程度的氧化。 傅里叶变换红外光谱仪（FTIR）根据确定不合格的表扣包含助焊剂，显示焊剂的位置。

公开(公告)号：US20110182405A1

公开(公告)日：2011-07-28

申请号：US12939101

申请日：2010-11-03

Applicant: WEI-CHIANG LEE

Inventor： WEI-CHIANG LEE

IPC: G01N23/02

CPC classification number: G01N23/04 ,  G01N2223/1016 ,  G01N2223/629 ,  G01N2223/646

Abstract: A detection method detects cracks with small thickness and solder voids with small volume in a solder ball. The method immerses a washed solder ball into a high absorption material solution for a first predetermined time period. The immersed solder ball is then dried in a vacuum chamber at a fixed temperature for a second predetermined time period. Materials of the high absorption material solution of the solder ball are removed by a low absorption material solution. An X-ray machine then detects the cracks and the solder voids in the solder ball.

Abstract translation: 检测方法检测焊球中具有小体积的小裂纹和小体积的焊料空隙。 该方法将洗涤的焊球浸入高吸收性材料溶液中达到第一预定时间段。 然后将浸入的焊球在真空室中以固定温度干燥第二预定时间段。 通过低吸收材料溶液去除焊球的高吸收材料溶液的材料。 然后X射线机检测焊球中的裂缝和焊料空隙。