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1.发明授权Apparatus for forming modular sockets using flexible interconnects and resulting structures 失效用于使用柔性互连和结构的结构形成模块化插座的装置公开(公告)号：US07094108B2
公开(公告)日：2006-08-22
申请号：US10401199
申请日：2003-03-27
IPC分类号： H01R24/00
CPC分类号： H01L25/0657 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06593 , H01L2924/0002 , H01L2924/3011 , H01R12/57 , H01R12/7082 , H01R12/721 , H01R12/856 , H01R13/24 , H01R13/514 , H05K7/023 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49169 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
摘要翻译： 提供了用于将多个微型半导体裸片附接到基板的模块化裸模插座组件。 插座组件由在水平叠层中垂直连接的多个双面板组成，其中每个板具有用于可裸插入裸半导体管芯的管芯插座。 多层互连引线带具有在一端弯曲的多个光刻形成的引线，以形成用于附接到可移除插入的半导体管芯上的接合焊盘并具有可连接到基板的相对端的节点。
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2.发明授权Apparatus for forming modular sockets using flexible interconnects and resulting structures 失效用于使用柔性互连和结构的结构形成模块化插座的装置公开(公告)号：US06612872B2
公开(公告)日：2003-09-02
申请号：US10158979
申请日：2002-05-30
IPC分类号： H01R2370
CPC分类号： H01L25/0657 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06593 , H01L2924/0002 , H01L2924/3011 , H01R12/57 , H01R12/7082 , H01R12/721 , H01R12/856 , H01R13/24 , H01R13/514 , H05K7/023 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49169 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
摘要翻译： 一种用于将多个微型半导体管芯附接到衬底的模块裸露裸露插座组件。 插座组件由在水平叠层中垂直连接的多个双面板组成，其中每个板具有用于可裸插入裸半导体管芯的管芯插座。 多层互连引线带具有在一端弯曲的多个光刻形成的引线，以形成用于附接到可移除插入的半导体管芯上的接合焊盘并具有可连接到基板的相对端的节点。
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3.发明授权Method for forming modular sockets using flexible interconnects and resulting structures 失效使用柔性互连和结构的结构形成模块化插座的方法公开(公告)号：US06453550B1
公开(公告)日：2002-09-24
申请号：US09482416
申请日：2000-01-13
IPC分类号： H05K300
CPC分类号： H01L25/0657 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06593 , H01L2924/0002 , H01L2924/3011 , H01R12/57 , H01R12/7082 , H01R12/721 , H01R12/856 , H01R13/24 , H01R13/514 , H05K7/023 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49169 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.
摘要翻译： 用于形成模块化裸模插座组件10并将多个微型半导体裸片18附接到衬底的方法。 插座组件10由在水平叠层中垂直连接的多个双面板14组成，其中每个板14具有用于可裸插入裸半导体管芯18的管芯插座22.多层互连引线带50 具有在一端弯曲的多个光刻形成的引线以形成用于附接到可移除插入的半导体管芯18上的接合焊盘90的节点88，并且具有可连接到基板的相对端92。
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4.发明授权Method for forming modular sockets using flexible interconnects and resulting structures 失效使用柔性互连和结构的结构形成模块化插座的方法公开(公告)号：US06760970B2
公开(公告)日：2004-07-13
申请号：US10218334
申请日：2002-08-13
IPC分类号： H05K300
CPC分类号： H01L25/0657 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06593 , H01L2924/0002 , H01L2924/3011 , H01R12/57 , H01R12/7082 , H01R12/721 , H01R12/856 , H01R13/24 , H01R13/514 , H05K7/023 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49169 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.
摘要翻译： 用于形成模块化裸模插座组件10并将多个微型半导体裸片18附接到衬底的方法。 插座组件10由在水平叠层中垂直连接的多个双面板14组成，其中每个板14具有用于可裸插入裸半导体管芯18的管芯插座22.多层互连引线带50 具有在一端弯曲的多个光刻形成的引线以形成用于附接到可移除插入的半导体管芯18上的接合焊盘90的节点88，并且具有可连接到基板的相对端92。
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5.发明授权Method and apparatus for forming modular sockets using flexible interconnects and resulting structures 失效用于使用柔性互连和结构的结构形成模块化插座的装置公开(公告)号：US06758696B2
公开(公告)日：2004-07-06
申请号：US10401052
申请日：2003-03-27
IPC分类号： H01R2370
CPC分类号： H01L25/0657 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06593 , H01L2924/0002 , H01L2924/3011 , H01R12/57 , H01R12/7082 , H01R12/721 , H01R12/856 , H01R13/24 , H01R13/514 , H05K7/023 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49169 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
摘要翻译： 一种用于将多个微型半导体管芯附接到衬底的模块裸露裸露插座组件。 插座组件由在水平叠层中垂直连接的多个双面板组成，其中每个板具有用于可裸插入裸半导体管芯的管芯插座。 多层互连引线带具有在一端弯曲的多个光刻形成的引线，以形成用于附接到可移除插入的半导体管芯上的接合焊盘并具有可连接到基板的相对端的节点。
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6.发明授权Method and apparatus for forming modular sockets using flexible interconnects and resulting structures 失效用于使用柔性互连和结构的结构形成模块插座的方法和装置公开(公告)号：US06478627B2
公开(公告)日：2002-11-12
申请号：US09876805
申请日：2001-06-07
IPC分类号： H01R2370
CPC分类号： H01L25/0657 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06593 , H01L2924/0002 , H01L2924/3011 , H01R12/57 , H01R12/7082 , H01R12/721 , H01R12/856 , H01R13/24 , H01R13/514 , H05K7/023 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49169 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
摘要翻译： 一种用于将多个微型半导体管芯附接到衬底的模块裸露裸露插座组件。 插座组件由在水平叠层中垂直连接的多个双面板组成，其中每个板具有用于可裸插入裸半导体管芯的管芯插座。 多层互连引线带具有在一端弯曲的多个光刻形成的引线，以形成用于附接到可移除插入的半导体管芯上的接合焊盘并具有可连接到基板的相对端的节点。
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公开(公告)号：US07367845B2
公开(公告)日：2008-05-06
申请号：US11600395
申请日：2006-11-16
IPC分类号： H01L23/70
CPC分类号： H01L25/0657 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06593 , H01L2924/0002 , H01L2924/3011 , H01R12/57 , H01R12/7082 , H01R12/721 , H01R12/856 , H01R13/24 , H01R13/514 , H05K7/023 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49169 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
摘要翻译： 提供了用于将多个微型半导体裸片附接到基板的模块化裸模插座组件。 插座组件由在水平叠层中垂直连接的多个双面板组成，其中每个板具有用于可裸插入裸半导体管芯的管芯插座。 多层互连引线带具有在一端弯曲的多个光刻形成的引线，以形成用于附接到可移除插入的半导体管芯上的接合焊盘并具有可连接到基板的相对端的节点。
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8.发明授权Apparatus for forming modular sockets using flexible interconnects and resulting structures 失效用于使用柔性互连和结构的结构形成模块化插座的装置公开(公告)号：US07192311B2
公开(公告)日：2007-03-20
申请号：US11204081
申请日：2005-08-15
IPC分类号： H01R24/00
CPC分类号： H01L25/0657 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06593 , H01L2924/0002 , H01L2924/3011 , H01R12/57 , H01R12/7082 , H01R12/721 , H01R12/856 , H01R13/24 , H01R13/514 , H05K7/023 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49169 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
摘要翻译： 提供了用于将多个微型半导体裸片附接到基板的模块化裸模插座组件。 插座组件由在水平叠层中垂直连接的多个双面板组成，其中每个板具有用于可裸插入裸半导体管芯的管芯插座。 多层互连引线带具有在一端弯曲的多个光刻形成的引线，以形成用于附接到可移除插入的半导体管芯上的接合焊盘并具有可连接到基板的相对端的节点。
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9.发明授权Method and apparatus for forming modular sockets using flexible interconnects and resulting structures 失效用于使用柔性互连和结构的结构形成模块插座的方法和装置公开(公告)号：US07153164B2
公开(公告)日：2006-12-26
申请号：US10400858
申请日：2003-03-27
IPC分类号： H01R24/00
CPC分类号： H01L25/0657 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06593 , H01L2924/0002 , H01L2924/3011 , H01R12/57 , H01R12/7082 , H01R12/721 , H01R12/856 , H01R13/24 , H01R13/514 , H05K7/023 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49169 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
摘要翻译： 提供了用于将多个微型半导体裸片附接到基板的模块化裸模插座组件。 插座组件由在水平叠层中垂直连接的多个双面板组成，其中每个板具有用于可裸插入裸半导体管芯的管芯插座。 多层互连引线带具有在一端弯曲的多个光刻形成的引线，以形成用于附接到可移除插入的半导体管芯上的接合焊盘并具有可连接到基板的相对端的节点。
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公开(公告)号：US07040930B2
公开(公告)日：2006-05-09
申请号：US11050100
申请日：2005-02-03
IPC分类号： H01R24/00
CPC分类号： H01L25/0657 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06593 , H01L2924/0002 , H01L2924/3011 , H01R12/57 , H01R12/7082 , H01R12/721 , H01R12/856 , H01R13/24 , H01R13/514 , H05K7/023 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49169 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor die to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
摘要翻译： 提供了用于将多个微型半导体管芯附接到基板的模块化裸芯片插座组件。 插座组件由在水平叠层中垂直连接的多个双面板组成，其中每个板具有用于可裸插入裸半导体管芯的管芯插座。 多层互连引线带具有在一端弯曲的多个光刻形成的引线，以形成用于附接到可移除插入的半导体管芯上的接合焊盘并具有可连接到基板的相对端的节点。
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