公开(公告)号：US11967764B1

公开(公告)日：2024-04-23

申请号：US17508757

申请日：2021-10-22

Applicant: Waymo LLC

Inventor： Edwin Lim ,  Marvin Weinstein

IPC: H01Q1/50 ,  H01P3/12 ,  H01P3/16 ,  H01Q21/00 ,  H01Q21/24

CPC classification number: H01Q21/0006 ,  H01P3/121 ,  H01P3/16 ,  H01Q1/50 ,  H01Q21/24

Abstract: Example embodiments relate to a substrate integrated waveguide (SIW) with dual circular polarizations. An example SIW may include a dielectric substrate and a first metallic layer coupled to a top surface of the dielectric substrate with a through-hole extending through the dielectric substrate and the first metallic layer. The SIW also includes a dielectric layer coupled to a top surface of the first metallic layer. A second metallic layer is coupled to a top surface of the dielectric layer. The second metallic layer includes a non-conductive opening, a plurality of feeds with a first end in the non-conductive opening and a second end including a single-ended termination, and an impedance transformer. The SIW also includes a third metallic layer coupled to a bottom of the dielectric substrate, and a set of metallic via-holes proximate the non-conductive opening and coupling the second metallic layer to the third metallic layer.

公开(公告)号：US20220209385A1

公开(公告)日：2022-06-30

申请号：US17135268

申请日：2020-12-28

Applicant: Waymo LLC

Inventor： Edwin Lim ,  Tegan Argo ,  Marvin Weinstein

IPC: H01P3/12 ,  H05K1/02 ,  H01P3/08

Abstract: Example embodiments relate to substrate integrated waveguide (SIW) transitions. An example SIW may include a dielectric substrate having a top surface and a bottom surface and a first metallic layer portion coupled to the top surface of the dielectric substrate that includes a single-ended termination, an impedance transformer, and a metallic rectangular patch located within an open portion in the first metallic layer portion such that the open portion forms a non-conductive loop around the metallic rectangular patch. The SIW also includes a second metallic layer portion coupled to the bottom surface of the dielectric substrate and metallic via-holes electrically coupling the first metallic layer to the second metallic layer. The SIW may be implemented in a radar unit to couple antennas to a printed circuit board (PCB). In some examples, the SIW may be implemented with only a non-conductive opening that lacks the metallic rectangular patch.

公开(公告)号：US20240250448A1

公开(公告)日：2024-07-25

申请号：US18597231

申请日：2024-03-06

Applicant: Waymo LLC

Inventor： Edwin Lim ,  Marvin Weinstein

IPC: H01Q21/00 ,  H01P3/12 ,  H01P3/16 ,  H01Q1/50 ,  H01Q21/24

CPC classification number: H01Q21/0006 ,  H01P3/121 ,  H01P3/16 ,  H01Q1/50 ,  H01Q21/24

Abstract: Example embodiments relate to a substrate integrated waveguide (SIW) with dual circular polarizations. An example SIW may include a dielectric substrate and a first metallic layer coupled to a top surface of the dielectric substrate with a through-hole extending through the dielectric substrate and the first metallic layer. The SIW also includes a dielectric layer coupled to a top surface of the first metallic layer. A second metallic layer is coupled to a top surface of the dielectric layer. The second metallic layer includes a non-conductive opening, a plurality of feeds with a first end in the non-conductive opening and a second end including a single-ended termination, and an impedance transformer. The SIW also includes a third metallic layer coupled to a bottom of the dielectric substrate, and a set of metallic via-holes proximate the non-conductive opening and coupling the second metallic layer to the third metallic layer.

公开(公告)号：US11894595B2

公开(公告)日：2024-02-06

申请号：US18059655

申请日：2022-11-29

Applicant: Waymo LLC

Inventor： Edwin Lim ,  Tegan Argo ,  Marvin Weinstein

IPC: H01P5/107 ,  H01P3/12 ,  H01P3/08 ,  H05K1/02

CPC classification number: H01P5/107 ,  H01P3/082 ,  H01P3/121 ,  H05K1/024 ,  H05K2201/0195

Abstract: Example embodiments relate to substrate integrated waveguide (SIW) transitions. An example SIW may include a dielectric substrate having a top surface and a bottom surface and a first metallic layer portion coupled to the top surface of the dielectric substrate that includes a single-ended termination, an impedance transformer, and a metallic rectangular patch located within an open portion in the first metallic layer portion such that the open portion forms a non-conductive loop around the metallic rectangular patch. The SIW also includes a second metallic layer portion coupled to the bottom surface of the dielectric substrate and metallic via-holes electrically coupling the first metallic layer to the second metallic layer. The SIW may be implemented in a radar unit to couple antennas to a printed circuit board (PCB). In some examples, the SIW may be implemented with only a non-conductive opening that lacks the metallic rectangular patch.

公开(公告)号：US11539107B2

公开(公告)日：2022-12-27

申请号：US17135268

申请日：2020-12-28

Applicant: Waymo LLC

Inventor： Edwin Lim ,  Tegan Argo ,  Marvin Weinstein

IPC: H01P5/107 ,  H01P3/12 ,  H01P3/08 ,  H05K1/02

Abstract: Example embodiments relate to substrate integrated waveguide (SIW) transitions. An example SIW may include a dielectric substrate having a top surface and a bottom surface and a first metallic layer portion coupled to the top surface of the dielectric substrate that includes a single-ended termination, an impedance transformer, and a metallic rectangular patch located within an open portion in the first metallic layer portion such that the open portion forms a non-conductive loop around the metallic rectangular patch. The SIW also includes a second metallic layer portion coupled to the bottom surface of the dielectric substrate and metallic via-holes electrically coupling the first metallic layer to the second metallic layer. The SIW may be implemented in a radar unit to couple antennas to a printed circuit board (PCB). In some examples, the SIW may be implemented with only a non-conductive opening that lacks the metallic rectangular patch.