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公开(公告)号：US12096563B2
公开(公告)日：2024-09-17
申请号：US17446598
申请日：2021-08-31
申请人： Liquid Wire Inc.
发明人： Mark William Ronay , Trevor Antonio Rivera , Michael Adventure Hopkins , Katherine M. Nelson , Charles J. Kinzel
CPC分类号： H05K1/189 , H05K1/0283 , H05K1/147 , H05K1/092 , H05K1/115 , H05K2201/0129 , H05K2201/0195 , H05K2201/049 , H05K2201/10098 , H05K2201/10106 , H05K2201/10128 , H05K2201/10151 , H05K2201/10219
摘要： A flexible hybrid electronic system and method includes a first structure and a second structure. The first structure includes a first flexible substrate, a first electronic component secured to the first flexible substrate, and a first flexible conductive trace formed in part from conductive gel. The second structure includes a second flexible substrate, a second electronic component secured to the second flexible substrate, and a second flexible conductive trace formed in part from conductive gel. The first structure is bonded to the second structure at an interconnect region, the first conductive trace is electrically coupled to the second conductive trace within the interconnect region, and the first electronic component is operatively coupled to the second electronic component.
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公开(公告)号：US11924980B2
公开(公告)日：2024-03-05
申请号：US17575717
申请日：2022-01-14
CPC分类号： H05K3/4635 , H05K1/0277 , H05K1/036 , H05K3/4688 , H05K2201/0141 , H05K2201/015 , H05K2201/0195 , H05K2201/09827
摘要： A method for manufacturing a multilayer substrate including first and second insulating resin base material layers including different materials, includes configuring a conductor film-attached insulating resin base material with a conductor film on the first insulating resin base material layer, or a second conductor film-attached insulating resin base material with a conductor film on a main surface of the first insulating resin base material layer including a main surface of a stacked body including at least the first insulating resin base material layer, and stacking the first or second conductor film-attached insulating resin base material and another base material layer such that the conductor film is in contact with the second insulating resin base material layer. An adhesion strength of the first insulating resin base material layer to the conductor film is higher than an adhesion strength of the second insulating resin base material layer to the conductor film.
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公开(公告)号：US11917746B2
公开(公告)日：2024-02-27
申请号：US17660261
申请日：2022-04-22
申请人： Raytheon Company
CPC分类号： H05K1/0209 , H05K1/023 , H05K1/0298 , H05K3/205 , H05K3/3436 , H05K2201/0195 , H05K2201/064 , H05K2203/043 , H05K2203/1453 , H05K2203/304
摘要： A method of forming a heat spreader on a printed circuit board (PCB), having a power dissipating component operably coupled thereto, includes attaching a thermally and electrically conductive structure, to a first side of the PCB to define a first PCB region that includes the component and a second PCB region without. The underside of the component is underfilled to electrically insulate its solder contacts. A first protective layer is applied to the second region of the PCB. A conductive plating membrane is deposited to the first region, the second region, and to the structure. A second protective layer is applied over a portion of the conductive plating membrane that overlays the second region, leaving exposed the rest of the conductive plating membrane. An electrically and thermally conductive layer is electroplated over the exposed areas of the conductive plating membrane, to form a heat exchanger within the first region.
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公开(公告)号：US11903145B2
公开(公告)日：2024-02-13
申请号：US17379026
申请日：2021-07-19
发明人： Seung-Yeol Yang
CPC分类号： H05K3/4605 , H05K1/112 , H05K3/4644 , H05K2201/0195 , H05K2201/0209 , H05K2203/1377
摘要： A wiring board may include a core portion having first and second surfaces, and first and second buildup portions on the first and second surfaces, respectively. Each of the first and second buildup portions may include a first insulating layer on the core portion, a wire pattern on the first insulating layer, a second insulating layer on the first insulating layer to cover the wire pattern, and a protection layer covering the second insulating layer and exposing a portion of the wire pattern. The second insulating layer may include a resin layer and inorganic fillers distributed in the resin layer. The fillers may not be provided in the protection layer, and the resin layer of the second insulating layer and the protection layer may be formed of the same material. The wire patterns of the first and second buildup portions may be electrically connected to each other.
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公开(公告)号：US11832395B2
公开(公告)日：2023-11-28
申请号：US17132472
申请日：2020-12-23
IPC分类号： H05K1/02 , H05K1/03 , H05K1/09 , H05K3/20 , H05K3/28 , H05K3/38 , H05K3/40 , H05K7/02 , H05K7/06 , H01L21/48 , H01L31/20 , H01L31/0216 , H01L31/0224 , H01L31/0392 , B41M5/44 , B41M5/392 , B41M5/395 , B41M1/12 , H05K3/34 , H05K1/16
CPC分类号： H05K3/207 , B41M1/12 , H01L31/02167 , H01L31/022425 , H01L31/022433 , H01L31/03926 , H01L31/206 , H05K1/0393 , H05K1/092 , H05K3/3485 , H05K3/386 , H05K1/165 , H05K2201/0195 , H05K2201/035 , H05K2201/0338 , H05K2201/0391 , H05K2201/10098 , H05K2203/0139 , H05K2203/1105 , H05K2203/1131 , H05K2203/1476 , H05K2203/1545 , Y02E10/50
摘要： A method is disclosed for applying an electrical conductor to an electrically insulating substrate, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of the substrate. A pressure is then applied between the substrate and the membrane(s) so that the composition loaded to the grooves adheres to the substrate. The membrane(s) and the substrate are separated and the composition in the groove is left on the surface of the electrically insulating substrate. The electrically conductive particles in the composition are then sintered to form a pattern of electrical conductors on the substrate, the pattern corresponding to the pattern formed in the membrane(s).
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公开(公告)号：US20230345616A1
公开(公告)日：2023-10-26
申请号：US17660261
申请日：2022-04-22
申请人： Raytheon Company
CPC分类号： H05K1/0209 , H05K1/023 , H05K1/0298 , H05K3/205 , H05K3/3436 , H05K2203/1453 , H05K2201/0195 , H05K2201/064 , H05K2203/043 , H05K2203/304
摘要： A method of forming a heat spreader on a printed circuit board (PCB), having a power dissipating component operably coupled thereto, includes attaching a thermally and electrically conductive structure, to a first side of the PCB to define a first PCB region that includes the component and a second PCB region without. The underside of the component is underfilled to electrically insulate its solder contacts. A first protective layer is applied to the second region of the PCB. A conductive plating membrane is deposited to the first region, the second region, and to the structure. A second protective layer is applied over a portion of the conductive plating membrane that overlays the second region, leaving exposed the rest of the conductive plating membrane. An electrically and thermally conductive layer is electroplated over the exposed areas of the conductive plating membrane, to form a heat exchanger within the first region.
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公开(公告)号：US20230309221A1
公开(公告)日：2023-09-28
申请号：US18096062
申请日：2023-01-12
申请人： Thintronics, Inc.
发明人： Tarun Amla , Stefan J. Pastine
CPC分类号： H05K1/0373 , H05K1/115 , H05K2201/0209 , H05K2201/0195 , H05K2201/068
摘要： Described herein are dielectric polymer films and printed circuit boards, such as multilayer and high-density interconnect printed circuit board comprising at least one dielectric polymer film.
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公开(公告)号：US20230262890A1
公开(公告)日：2023-08-17
申请号：US17938977
申请日：2022-09-07
发明人： Chih-Chiang Lu , Chi-Min Chang , Ming-Hao Wu , Yi-Pin Lin , Tung-Chang Lin , Jun-Rui Huang
CPC分类号： H05K1/115 , H05K1/0222 , H05K2201/0195 , H05K2201/09536 , H05K2201/09809
摘要： A circuit board structure includes a substrate, a first build-up structure layer, first and second external circuit layers, at least one first conductive via, and second conductive vias. The first build-up structure layer is disposed on a first circuit layer of the substrate. The first external circuit layer is disposed on the first build-up structure layer. The second external circuit layer is disposed on a second circuit layer and a portion of a third dielectric layer of the substrate. The first conductive via is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias surround the first conductive via, and the first external circuit layer, the second conductive vias, the first circuit layer, the outer conductive layer, and the second external circuit layer define a first ground path. The first ground path surrounds the signal path.
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公开(公告)号：US20230239997A1
公开(公告)日：2023-07-27
申请号：US17701964
申请日：2022-03-23
发明人： Tzu Hsuan Wang , Yu Cheng Lin
IPC分类号： H05K1/02
CPC分类号： H05K1/024 , H05K1/0242 , H05K1/0251 , H05K1/0298 , H05K2201/0195
摘要： A method of a circuit signal enhancement of a circuit board comprises the following steps: forming a first substrate body with a first signal transmission circuit layer and a second substrate body with a second signal transmission circuit layer; forming a first signal enhancement circuit layer and a second signal enhancement circuit layer on the first substrate body and the second substrate body; forming a third substrate body with a third signal transmission circuit layer and a fourth substrate body with a fourth signal transmission circuit layer on the carrier; separating the third substrate body and the fourth substrate body from the carrier; combining the first signal transmission circuit layer and the third signal transmission circuit layer through the first signal enhancement circuit layer; and combining the second signal transmission circuit layer and the fourth signal transmission circuit layer through the second signal enhancement circuit layer.
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公开(公告)号：US20230223200A1
公开(公告)日：2023-07-13
申请号：US17572723
申请日：2022-01-11
申请人： Imagine TF, LLC
CPC分类号： H01G4/33 , H01G4/232 , H01G4/012 , H05K1/162 , H05K1/0298 , H05K2201/0195 , H05K2201/09672 , H05K2201/0379 , H05K2201/0317 , H05K2201/0187
摘要： A capacitor device to store electrical charge is disclosed that includes a first unit of a first conductor layer fabricated from a first material. The first conductor layer is sandwiched between two dielectric layers. This assembly is layered on a second unit of a second conductor layer fabricated from a second material and sandwiched between two additional dielectric layers. The first conductor layers are all electrically connected to one another, and the second conductor layers being electrically connected to one another but are not electrically connected to the first conductor. Any multiple of first and second units may be utilized.
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